Technical data

Mechanics 15/72

netRAPID Chip Carrier | Design Guide

Soldering

netRAPID devices can be placed on the PCB of the host system for SMD production. netRAPID

can be picked and placed (from the tray to the PCB of the host system) using asymmetric suck in.

Place netRAPID on the top side of the PCB of the host system.

Important note: The thermal profile for reflow soldering depends on the used soldering paste and

the used reflow system. Read the data sheet of the manufacturer of the used soldering paste for

requirements to the thermal profile.

When using the Heraeus soldering paste Sn/Ag/Cu-95.5/4/0.5 (F620CU0.5-88M3 lead free) then

the following thermal profile is recommended:

Figure 8: Thermal profile for reflow soldering

Adhesion keeps the components on the netRAPID in place during the reflow soldering.