Technical data

Mechanics 14/72

netRAPID Chip Carrier | Design Guide

This results in requirements for the PCB of the host system:

 Use at least 9 vias, which are to be connected to ground plane.

 Use a large copper surface on the PCB of the host system to reach a good heat dissipation

for the netRAPID.

 Don’t place components on the PCB of the host system below the netRAPID to avoid heat

dissipation of other component than netRAPID.

The thermal pad of the netRAPID device has GND potential.

Figure 6 on page 12 shows position and size of the thermal pad for NRP 10 and Figure 7 on page

13 shows it for NRP 52.

3.2.3 Keep-out area

Make sure that no vias and no wires are on the PCB of the host system underneath the netRAPID

device.

Important note: Make sure to use the thermal pad. Figure 6 on page 12 shows position and size

of the thermal pad for NRP 10 and Figure 7 on page 13 shows it for NRP 52.

3.3 Tempering, storage and soldering

Tempering

netRAPID have to be tempered to reduce unwanted moisture before they are soldered onto the

host system. If the moisture is not reduced then the heating during the soldering process to more

than 200 °C can lead possible destruction of electronic parts of the netRAPID. To avoid this,

netRAPID have to be tempered 24 h at 80 °C.

Hilscher tempers netRAPID devices before they are shipped. After tempered, netRAPID devices

are shipped welded in a tray.

Moisture sensitivity level

The Moisture Sensitivity Level (MSL) is MSL 3, 168 h, 30 °C / 60%RH.

Storage

The netRAPID in a welded (sealed) tray can be stored up to 1 year. After 1 year the netRAPID

devices have to be tempered again, before soldered onto a host system.