Specifications

LV5692P, LV5693P Application Note

http://onsemi.com

c．Silicone grease

・Spread the silicone grease evenly when mounting heat sinks.

・Our company recommends YG-6260 （ Momentive Performance Materials Japan LLC ）

d．Mount

・First mount the heat sink on the semiconductor device, and then mount that assembly on the

printed circuit board.

・ When attaching a heat sink after mounting a semiconductor device into the printed circuit board,

when tightening up a heat sink with the screw, the mechanical stress which is impossible to the

semiconductor device and the pin doesn't hang.

e．When mounting the semiconductor device to the heat sink using jigs, etc.,

・Take care not to allow the device to ride onto the jig or positioning dowel.

・Design the jig so that no unreasonable mechanical stress is not applied to the semiconductor

device.

ｆ．Heat sink screw holes

・Be sure that chamfering and shear drop of heat sinks must not be larger than the diameter of screw

head used.

・ When using nuts, do not make the heat sink hole diameters larger than the diameter of the head of

the screws used. A hole diameter about 15% larger than the diameter of the screw is desirable.

・ When tap screws are used, be sure that the diameter of the holes in the heat sink are not too small.

A diameter about 15% smaller than the diameter of the screw is desirable.

ｇ． There is a method to mount the semiconductor device to the heat sink by using a spring band.

But this method is not recommended because of possible displacement due to fluctuation of the spring

force with time or vibration.

9. Application Circuit Example

IC’s operating characteristics are influenced by PCB layout, connection, parasitic capacitance and

inductance. Therefore, make sure to use the system that will actually be offered to the market and

define a constant after a sufficient evaluation.