Product Info

LTE Module Series
EC21 Hardware Design
EC21_Hardware_Design
3-27
/ 105
USIM2_VDD
128
PO
SGMII MDIO pull-up
power source
Configurable power
source.
1.8V/2.85V power
domain.
External pull-up for
SGMII MDIO pins.
If unused, keep it
open.
SGMII_TX_M
123
AO
SGMII transmission
- minus
If unused, keep it
open.
SGMII_TX_P
124
AO
SGMII transmission
- plus
If unused, keep it
open.
SGMII_RX_P
125
AI
SGMII receiving
- plus
If unused, keep it
open.
SGMII_RX_M
126
AI
SGMII receiving
- minus
If unused, keep it
open.
RF Interface
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
ANT_DIV
35
AI
Diversity antenna
pad
50Ω impedance
If unused, keep it
open.
ANT_MAIN
49
IO
Main antenna pad
50Ω impedance
ANT_GNSS
47
AI
GNSS antenna pad
50Ω impedance
If unused, keep it
open.
GPIO Pins
Pin Name
Pin No.
I/O
Description
DC Characteristics
Comment
WAKEUP_IN
1
DI
Sleep mode control
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
Cannot be pulled up
before startup.
Low level wakes up
the module.
If unused, keep it
open.
W_DISABLE#
4
DI
Airplane mode
control
V
IL
min=-0.3V
V
IL
max=0.6V
V
IH
min=1.2V
V
IH
max=2.0V
1.8V power domain.
Pull-up by default.
At low voltage level,
module can enter into
airplane mode.
If unused, keep it