Product Info

LTE Module Series
EC21 Hardware Design
EC21_Hardware_Design
10
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FIGURE 38: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM)...................................................... 66
FIGURE 39: MECHANICALS OF U.FL-LP CONNECTORS...................................................................................... 67
FIGURE 40: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM)................................................................... 67
FIGURE 41: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE).....................82
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BOTTOM OF CUSTOMERS’ PCB)...82
FIGURE 43: MODULE TOP AND SIDE DIMENSIONS...............................................................................................84
FIGURE 44: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW)..........................................................................85
FIGURE 45: RECOMMENDED FOOTPRINT (TOP VIEW)........................................................................................86
FIGURE 46: TOP VIEW OF THE MODULE.................................................................................................................. 87
FIGURE 47: BOTTOM VIEW OF THE MODULE......................................................................................................... 87
FIGURE 48: REFLOW SOLDERING THERMAL PROFILE....................................................................................... 89
FIGURE 49: TAPE AND REEL SPECIFICATIONS......................................................................................................90