Product Manual
Table Of Contents
Cambricon®
Copyright © 2020 Cambricon Corporation
14
9Table 4.9 SMBUS Register description
Register definition Address
Reading
and
writing
Note
Card power consumption 0x01 RO Power consumption, float, unit W
Card Temperature 0x02 RO Card temperature,float, unit ℃
Chip temperature 0x03 RO Chip temperature,float, unit ℃
power brake 0x05 WO Main frequency reduce to 25% of current
value when write 0x04, and recover to
the frequency
before reducing when
write 0x01.
PCIE Vendor ID and Device ID 0xA0 RO [15:0] Vendor ID :0xCABC
[31:16] Device ID :0x0290
PCIE Sub-
Vendor ID and
Sub-System ID
0xA1 RO [15:0] Sub-Vendor ID :0xCABC
[31:16] Sub-System ID :0x0042
PCIE _negotiated_speed
0xA2
RO
Display PCIE negotiation rate, e.g .0 x 04
indicate gen4 16GT/s
PCIE_negotiated_link_width 0xA3 R O Display PCIE
negotiation width, e.g .0
x16 means X16.
Type of card 0xF0 RO Display card type
Manufacturer 0xF1 RO Display equipment manufacturer
number
Hardware version number 0xF2 RO Display hardware version number
Firmware version number 0xF3 RO
Show firmware version number, e.g .0
x04420100 mean
s master chip version
number 0x04, card type 0x42,master
version number 0x01,
sub version
number 0x0 and patch number 0x0.
Manufacturing time 0xF4 RO Display manufacturing time
, e.g .0
x2006 means manufactured
in June
2020
Serial number 0xF5 RO Display the serial number of the device,
e.g .0 x30001 indicating a serial number
of 30001