User's Manual

M889-00
Introduction To Servicing 3.1
Copyright TEL 02/10/95
3 Introduction To Servicing
This section provides some general and advisory information on servicing procedures.
The following topics are covered in this section.
Section Title Page
3.1
3.1.1
3.1.2
3.1.3
General
Caution: CMOS Devices
Caution: Aerial Load
Caution: Beryllium Oxide & Power Transistors
3.3
3.3
3.3
3.4
3.2
3.2.1
3.2.2
3.2.3
3.2.4
Mechanical
Pozidriv Recess Head Screws
UNC Thread Screws
Screw Torques
Disassembly/Reassembly
3.5
3.5
3.5
3.5
3.5
3.3
3.3.1
3.3.1.1
3.3.1.2
3.3.2
Component Replacement
Leaded Components
Desoldering Iron Method
Component Cutting Method
Surface Mount Devices
3.6
3.6
3.6
3.6
3.7
3.4
3.4.1
3.4.1.1
3.4.1.2
3.4.2
To Replace PA Transistors
Capacitor /Transistor Spacing
Q1 (2SC2933 Pre-Driver)
Q2, Q3, Q4, Q5 & Q6 (SD1414)
Replacement Procedure
3.8
3.8
3.8
3.8
3.8
3.5 To Remove The PCB From The Heatsink 3.10
3.6 To Remove Cased Mica Capacitors 3.10
Figure Title Page
3.1 Typical Anti-static Bench Set-up 3.3
3.2 Typical Transistor/Capacitor Spacing (Q1 & Q2 Shown) 3.9