User Guide

Gap defines the gap between the insulation bridges on a thermal sym
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bol. The specification is made as a % of the hole diameter, and is con
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strainedbymaximumandminimumvalues.
The Isolate values for Thermal and Annulus determine the width of the
thermalbridgeorring.
The Restring option determines whether the insulation bridge of the
thermal symbol should be drawn immediately at the edge of the hole or
at a distance from the hole given by the restring value (Restring tab, In
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ner setting).
If the Restring option for Annulus is deactivated, a filled circle is gener
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atedinsteadoftheannulusring.Thisisthedefaultsetting.
The isolate value for Thermal also applies to polygons. It determines the
distance between a polygon and the restring of the pad or via that is
joinedtothepolygonthroughathermalsymbol.
The Generate thermals for vias flag permits thermal symbols at through-
hole contacts. Otherwise vias are fully connected to the copper plane.
This applies also for polygons. But you can disable this option for indi
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vidualpolygons(CHANGETHERMALSOFF).
Calculationsforautomaticallycreatedsymbolsinsupplylayers:
Annulus:
Inner diameter = pad hole diameter + 2 * restring
Outer diameter = max(pad-hole diameter, inner diameter)
+ 2*isolate
Default:restring=0(fullyfilled),isolate=20(mil).
Thermal:
Inner diameter = pad hole diameter + 2 * restring
Outer diameter = inner diameter + 2 * isolate
Isolate Gap Restring
Pads or smds marked with the flag NOTHERMALS (resp. CHANGE
THERMALS OFF) in the Package Editor will be connected basically
withoutthermalsymbols.
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FromSchematictoFinishedBoard