User Guide
File
Active
layer
s
Comments/recommendedoptions
demo.cmp
Top
Via
Pad
Componentside.
Options:pos.coord.,optimize,fillpads.
demo.ly2
Via
Pad
Multilayerinnerlayer.
Options:pos.coord.,optimize,fillpads.
demo.ly3
$GND Multilayersupplylayer.
Isautomaticallyoutputinverse.
Options:pos.coord.,optimize.
demo.sol
Bottom
Vias
Pads
Solderside.
Options:pos.coord.,optimize,fillpads.
demo.plc
tPlace
Dimension
tName
Componentsidesilkscreen.
Options:pos.coord.,optimize.
demo.pls
bPlace
Dimension
bName
Soldersidesilkscreen.
Onlyneedediftherearecomponentsonthe
underside
Options:pos.coord.,optimize.
demo.stc
tStop Componentsidesoldermask.
Options:pos.coord.,optimize.
demo.sts
bStop Soldersidesoldermask.
Options:pos.coord.,optimize.
demo.crc
tCream Componentsidecreamframe.
Options:pos.Coord.,Optimize.
demo.crs
bCream Soldersidecreamframe.
OnlyrequiredifthereareSMDcomponentson
theunderside
Options:pos.Coord.,Optimize.
demo.drd
Drills
Holes
DrillingdataforNCdrillingmachines.
Options:(rotate),pos.coord.,optimize.
AdditionalInformationfortheBoardManufacturer
You must also supply the service company with the configuration files
for apertures (name.whl) and drills (name.drl). You can also include the
board file name.brd. This can help to avoid problems with what can be
-
come time-consuming questions. In general, alignment marks (which
are for example defined in layer 49, Reference) or an information field
(in,forexample,layer48, Documentation)canbeincluded.
A text file, such as demo.txt, should contain instructions for the board
manufacturer.
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EAGLEManual