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VSKDS201/045 www.vishay.
VSKDS201/045 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER Maximum average forward current per leg SYMBOL TEST CONDITIONS VALUES IF(AV) 50 % duty cycle at TC = 123 °C, rectangular waveform 100 5 μs sine or 3 μs rect.
VSKDS201/045 Vishay Semiconductors 1000 1000 TJ = 175 °C IR - Reverse Current (mA) IF - Instantaneous Forward Current (A) www.vishay.com TJ = 175 °C 100 TJ = 125 °C TJ = 25 °C 10 100 10 TJ = 125 °C 1 0.1 0.01 TJ = 25 °C 0.001 1 0 0.5 1.0 1.5 2.0 2.5 5 VFM - Forward Voltage Drop (V) 93234_01 10 15 20 25 30 35 40 45 VR - Reverse Voltage (V) 93234_02 Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.
VSKDS201/045 Vishay Semiconductors 120 180 160 140 120 DC 100 80 60 Square wave (D = 0.50) Rated VR applied 40 20 100 Average Power Loss (W) Allowable Case Temperature (°C) www.vishay.com 80 60 RMS limit 40 DC 20 See note (1) 0 0 0 93234_05 D = 0.75 D = 0.50 D = 0.33 D = 0.25 D = 0.20 50 100 150 200 250 0 300 IF(AV) - Average Forward Current (A) IFSM - Non-Repetitive Surge Current (A) 40 60 80 100 120 140 160 IF(AV) - Average Forward Current (A) 93234_06 Fig.
VSKDS201/045 www.vishay.com Vishay Semiconductors ORDERING INFORMATION TABLE Device code VS KD S 20 1 1 2 3 4 5 / 1 - Vishay Semiconductors product 2 - Circuit configuration: 045 6 KD = ADD-A-PAK - 2 diodes in series 3 - S = Schottky diode 4 - Average current rating (20 = 200 A) 5 - Product silicon identification 6 - Voltage rating (045 = 45 V) CIRCUIT CONFIGURATION (1) ~ (2) + (3) - LINKS TO RELATED DOCUMENTS Dimensions Revision: 04-Jan12 www.vishay.
Outline Dimensions Vishay Semiconductors ADD-A-PAK Generation VII - Diode DIMENSIONS in millimeters (inches) 29 ± 0.5 (1 ± 0.020) 30 ± 0.5 (1.18 ± 0.020) 35 REF. 18 (0.7) REF. 24 ± 0.5 (1 ± 0.020) 6.7 ± 0.3 (0.26 ± 0.012) Viti M5 x 0.8 Screws M5 x 0.8 Document Number: 95369 Revision: 11-Nov-08 7 6 4 5 3 2 1 6.3 ± 0.2 (0.248 ± 0.008) 22.6 ± 0.2 (0.89 ± 0.008) 80 ± 0.3 (3.15 ± 0.012) 15 ± 0.5 (0.59 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 92 ± 0.75 (3.6 ± 0.
VISHAY SEMICONDUCTORS Modules Application Note Mounting Instructions for ADD-A-PAK Generation VII Generation VII ADD-A-PAK (AAP) power modules combine the excellent thermal performance enabled by a direct bonded copper (Al2O3) substrate, superior mechanical ruggedness, and an environmentally friendly manufacturing process that eliminates the use of hard molds, thus reducing direct stresses on the leads. To prevent axial pull-out, the electrical terminals are co-molded to the module housing.
Application Note Vishay Semiconductors Mounting Instructions for ADD-A-PAK Generation VII Next, make a uniform coating on the heatsink mounting surfaces and module substrate with a good quality thermal compound. Screen printing of the compound is recommended, as well as direct application through a roller or spatula. The datasheet values for thermal resistance assume a uniform layer of thermal compound with a maximum thickness of 0.08 mm. The thermal conductivity of the compound should be no less than 0.
Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.
