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VSKCS408/060 www.vishay.
VSKCS408/060 www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS PARAMETER Maximum average forward current per module per leg SYMBOL TEST CONDITIONS IF(AV) 50 % duty cycle at TC = 102 °C, rectangular waveform 5 μs sine or 3 μs rect. pulse Following any rated load condition and with rated VRRM applied VALUES UNITS 400 200 25 500 A Maximum peak one cycle non-repetitive surge current IFSM Non-repetitive avalanche energy EAS TJ = 25 °C, IAS = 5.
VSKCS408/060 Vishay Semiconductors 1000 10 000 150 °C 100 TJ = 150 °C 10 TJ = 125 °C TJ = 25 °C 1 0.0 1000 IR - Reverse Current (mA) IF - Instantaneous Forward Current (A) www.vishay.com 125 °C 100 10 25 °C 1 0.1 0.01 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 10 20 30 40 50 60 VFM - Forward Voltage Drop (V) VR - Reverse Voltage (V) Fig. 1 - Maximum Forward Voltage Drop Characteristics Fig. 2 - Typical Values of Reverse Current vs.
VSKCS408/060 Vishay Semiconductors 250 160 Square wave (D = 0.50) 80 % rated VR applied 140 Average Power Loss (W) Allowable Case Temperature (°C) www.vishay.com 120 100 DC 80 60 40 20 200 D = 0.75 D = 0.50 D = 0.33 D = 0.25 D = 0.20 150 RMS limit 100 DC 50 see note (1) 0 0 0 100 200 300 400 0 500 50 100 150 200 250 300 IF(AV) - Average Forward Current (A) Fig. 5 - Maximum Allowable Case Temperature vs. Average Forward Current Fig.
VSKCS408/060 www.vishay.com Vishay Semiconductors ORDERING INFORMATION TABLE Device code VS KC S 40 8 1 2 3 4 5 / 1 - Vishay Semiconductors product 2 - Circuit configuration: 3 - S = Schottky diode 4 - Average rating (x 10) 5 - Product silicon identification 6 - Voltage rating (060 = 60 V) 060 6 KC = ADD-A-PAK - 2 diodes/common cathode CIRCUIT CONFIGURATION (1) + (2) - (3) - LINKS TO RELATED DOCUMENTS Dimensions Revision: 05-Jan-12 www.vishay.
Outline Dimensions Vishay Semiconductors ADD-A-PAK Generation VII - Diode DIMENSIONS in millimeters (inches) 29 ± 0.5 (1 ± 0.020) 30 ± 0.5 (1.18 ± 0.020) 35 REF. 18 (0.7) REF. 24 ± 0.5 (1 ± 0.020) 6.7 ± 0.3 (0.26 ± 0.012) Viti M5 x 0.8 Screws M5 x 0.8 Document Number: 95369 Revision: 11-Nov-08 7 6 4 5 3 2 1 6.3 ± 0.2 (0.248 ± 0.008) 22.6 ± 0.2 (0.89 ± 0.008) 80 ± 0.3 (3.15 ± 0.012) 15 ± 0.5 (0.59 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 20 ± 0.5 (0.79 ± 0.020) 92 ± 0.75 (3.6 ± 0.
VISHAY SEMICONDUCTORS Modules Application Note Mounting Instructions for ADD-A-PAK Generation VII Generation VII ADD-A-PAK (AAP) power modules combine the excellent thermal performance enabled by a direct bonded copper (Al2O3) substrate, superior mechanical ruggedness, and an environmentally friendly manufacturing process that eliminates the use of hard molds, thus reducing direct stresses on the leads. To prevent axial pull-out, the electrical terminals are co-molded to the module housing.
Application Note Vishay Semiconductors Mounting Instructions for ADD-A-PAK Generation VII Next, make a uniform coating on the heatsink mounting surfaces and module substrate with a good quality thermal compound. Screen printing of the compound is recommended, as well as direct application through a roller or spatula. The datasheet values for thermal resistance assume a uniform layer of thermal compound with a maximum thickness of 0.08 mm. The thermal conductivity of the compound should be no less than 0.
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