User guide

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Document Number: 93849
2 Revision: 28-Mar-08
VS390LM06CS02CB
Vishay High Power Products
Fast Recovery Diodes
ORDERING INFORMATION TABLE
Device code
1 - Vishay HPP device
2 - Chip dimension in mils
3 - Type of device: L = Wire bondable fast recovery diode
4 - Passivation process: M = Glassivated MOAT
5
- Voltage code: 600 V
6
- Metallization: H = Aluminum (anode) - silver (cathode)
7
-t
rr
code: S02 = 200 ns
8
- CB = Probed uncut die (wafer in box)
None = Probed die in chip carrier
51324678
VS 390 L M 06 C S02 CB
LINKS TO RELATED DOCUMENTS
Dimensions http://www.vishay.com/doc?95132