Instruction Manual

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Document Number: 93900
2 Revision: 28-Mar-08
VS370BG12DCB
Vishay High Power Products
Phase Control Thyristors
ORDERING INFORMATION TABLE
Device code
1 - Vishay HPP device
2 - Chip dimension in mils
3 - Type of device: B = Wire bondable SCR
4 - Passivation process: G = Glassivated MESA
5
- Voltage code x 100 = V
RRM
6
- Metallization: D = Silver (anode) - aluminum (cathode)
7
- CB = Probed uncut die (wafer in box)
None = Probed die in chip carrier
5132467
VS 370 B G 12 D CB
LINKS TO RELATED DOCUMENTS
Dimensions http://www.vishay.com/doc?95161