Manual

www.vishay.com For technical questions, contact: die-wafer@vishay.com
Document Number: 93836
2 Revision: 11-Apr-08
VS230SG..HCB Series
Vishay High Power Products
Phase Control Thyristors
ORDERING INFORMATION TABLE
1 - Vishay HPP device
2 - Chip dimension in mils
3 - Type of device: S = Solderable SCR
4 - Passivation process: G = Glassivated MESA
5 - Voltage code x 100 = V
RRM
6
- Metallization: H = Silver (anode) - silver (cathode)
7 - CB = Probed uncut die (wafer in box)
None = Probed die in chip carrier
Available class
06 = 600 V
12 = 1200 V
Device code
51324
67
VS 230 S G 12 H CB
LINKS TO RELATED DOCUMENTS
Dimensions http://www.vishay.com/doc?95300