User guide

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Document Number: 93820
2 Revision: 27-Mar-08
VS060LM06CS02CB
Vishay High Power Products
Fast Recovery Diode
ORDERING INFORMATION TABLE
Device code
1
- Vishay HPP device
2 - Chip dimension in mils
3 - Type of device: L = Wire bondable fast recovery diode
4 - Passivation process: M = Glassivated MOAT
5 - Voltage code x 100 = V
RRM
6
- Metallization: C = Aluminum (anode) - silver (cathode)
7 -t
rr
code
8
- CB = Probed uncut die (wafer in box)
CF = Inked probed sawn wafer on film (blue tape)
51324678
VS 060 L M 06 C S02 CB
LINKS TO RELATED DOCUMENTS
Dimensions http://www.vishay.com/doc?95117