User Manual

VS-GA200TH60S
www.vishay.com
Vishay Semiconductors
Revision: 17-Sep-12
1
Document Number: 94762
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molding Type Module IGBT,
2-in-1 Package, 600 V and 200 A
FEATURES
• High short circuit capability
• 10 μs short circuit capability
•V
CE(on)
with positive temperature coefficient
• Maximum junction temperature 150 °C
• Latch-up free
• Low inductance case
• Fast and soft reverse recovery antiparallel FWD
• Isolated copper baseplate using DCB (Direct Copper
Bonding) technology
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
TYPICAL APPLICATIONS
•UPS
• Switching mode power supplies
• Electronic welders
DESCRIPTION
Vishay’s IGBT power module provides ultra low conduction
loss as well as short circuit ruggedness. It is designed for
applications such as general UPS and SMPS.
Note
(1)
Repetitive rating: Pulse width limited by maximum junction temperature.
PRODUCT SUMMARY
V
CES
600 V
I
C
at T
C
= 80 °C 200 A
V
CE(on)
(typical)
at I
C
= 200 A, 25 °C
1.9 V
Double INT-A-PAK
ABSOLUTE MAXIMUM RATINGS (T
C
= 25 °C unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
CES
600
V
Gate to emitter voltage V
GES
± 20
Collector current I
C
T
C
= 25 °C 260
A
T
C
= 80 °C 200
Pulsed collector current I
CM
(1)
t
p
= 1 ms 400
Diode continuous forward current I
F
T
C
= 80 °C 200
Diode maximum forward current I
FM
t
p
= 1 ms 400
Maximum power dissipation P
D
T
J
= 150 °C 1042 W
Short circuit withstand time t
SC
T
C
= 125 °C 10 μs
RMS isolation voltage V
ISOL
f = 50 Hz, t = 1 min 2500 V
I
2
t-value, diode I
2
tV
R
= 0 V, t = 10 ms, T
J
= 125 °C 4900 A
2
s