Manual

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Document Number: 94044
2 Revision: 01-Aug-08
HFA90NH40PbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery Diode, 210 A
DYNAMIC RECOVERY CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
See fig. 5
t
rr
T
J
= 25 °C
I
F
= 90 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
- 90 140
ns
T
J
= 125 °C - 158 240
Peak recovery current
See fig. 6
I
RRM
T
J
= 25 °C - 9 17
A
T
J
= 125 °C - 15 30
Reverse recovery charge
See fig. 7
Q
rr
T
J
= 25 °C - 420 1100
nC
T
J
= 125 °C - 1200 3200
Peak rate of recovery current
See fig. 8
dI
(rec)M
/dt
T
J
= 25 °C - 370 -
A/µs
T
J
= 125 °C - 270 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range
T
J
, T
Stg
- 55 to 150 °C
Maximum thermal resistance,
junction to case
R
thJC
DC operation
See fig. 4
0.38
°C/W
Typical thermal resistance,
case to heatsink
R
thCS
Mounting surface, flat, smooth and greased 0.05
Approximate weight
30 g
1.06 oz.
Mounting torque
minimum Non-lubricated threads 3 (26.5)
N ⋅ m
(lbf ⋅ in)
maximum 4 (35.4)
Terminal torque
minimum 3.4 (30)
maximum 5 (44.2)
Case style HALF-PAK module