User guide

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Document Number: 94072
2 Revision: 01-Aug-08
HFA320NJ40CPbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery
Diode, 320 A
Note
(1)
Mounting surface must be smooth, flat, free of burrs or other protrusions. Apply a thin even film or thermal grease to mounting surface.
Gradually tighten each mounting bolt in 5 to 10 lbf ⋅ in steps until desired or maximum torque limits are reached.
DYNAMIC RECOVERY CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
See fig. 5
t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/µs, V
R
= 30 V - 45 -
nsT
J
= 25 °C
I
F
= 160 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
- 90 140
T
J
= 125 °C - 290 440
Peak recovery current
See fig. 6
I
RRM
T
J
= 25 °C - 8.7 20
A
T
J
= 125 °C - 18 30
Reverse recovery charge
See fig. 7
Q
rr
T
J
= 25 °C - 420 1100
nC
T
J
= 125 °C - 2600 7000
Peak rate of recovery current
See fig. 8
dI
(rec)M
/dt
T
J
= 25 °C - 300 -
A/µs
T
J
= 125 °C - 280 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL MIN. TYP. MAX. UNITS
Maximum junction and storage temperature range T
J
, T
Stg
- 55 - 150 °C
Thermal resistance, junction to case
per leg
R
thJC
- - 0.19
°C/W
K/W
per module - - 0.095
Typical thermal resistance, case to heatsink R
thCS
-0.10-
Weight
-68- g
-2.4-oz.
Mounting torque
(1)
30 (3.4) - 40 (4.6)
N ⋅ m
(lbf ⋅ in)
center hole 12 (1.4) - 18 (2.1)
Terminal torque 30 (3.4) - 40 (4.6)
Vertical pull --80
lbf ⋅ in
2" lever pull --35