Manual

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Document Number: 94063
2 Revision: 01-Aug-08
HFA240NJ40CPbF
Vishay High Power Products
HEXFRED
®
Ultrafast Soft Recovery
Diode, 240 A
Note
(1)
Mounting surface must be smooth, flat, free of burrs or other protrusions. Apply a thin even film or thermal grease to mounting surface.
Gradually tighten each mounting bolt in 5 to 10 lbf ⋅ in steps until desired or maximum torque limits are reached.
DYNAMIC RECOVERY CHARACTERISTICS (T
J
= 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Reverse recovery time
See fig. 5
t
rr
I
F
= 1.0 A, dI
F
/dt = 200 A/µs, V
R
= 30 V - 50 -
nsT
J
= 25 °C
I
F
= 140 A
dI
F
/dt = 200 A/µs
V
R
= 200 V
- 77 120
T
J
= 125 °C - 290 440
Peak recovery current
See fig. 6
I
RRM
T
J
= 25 °C - 7.5 14
A
T
J
= 125 °C - 16 30
Reverse recovery charge
See fig. 7
Q
rr
T
J
= 25 °C - 290 780
nC
T
J
= 125 °C - 2300 6300
Peak rate of recovery current
See fig. 8
dI
(rec)M
/dt
T
J
= 25 °C - 320 -
A/µs
T
J
= 125 °C - 270 -
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL MIN. TYP. MAX. UNITS
Maximum junction and storage temperature range T
J
, T
Stg
- 55 - 150 °C
Thermal resistance, junction to case
per leg
R
thJC
--0.19
°C/Wper module - - 0.095
Typical thermal resistance, case to heatsink R
thCS
-0.10-
Weight
-68- g
-2.4-oz.
Mounting torque
(1)
30 (3.4) - 40 (4.6)
N ⋅ m
(lbf ⋅ in)
center hole 12 (1.4) - 18 (2.1)
Terminal torque 30 (3.4) - 40 (4.6)
Vertical pull - - 80
lbf ⋅ in
2" lever pull - - 35