Owner's manual

Document Number: 51054 For technical questions, contact: sfer@vishay.com
www.vishay.com
Revision: 19-Jan-09 15
DTO25
Surface Mounted Power Resistor
Thick Film Technology
Vishay Sfernice
Preliminary
POWER RATING CHART
The temperature of the case should be maintained within the limits specified.
SPECIAL FEATURES
Resistance Values 0.016 0.1 0.5
Typical Temperature Coefficient
(- 55 °C to + 150 °C)
± 800 ppm/°C ± 250 ppm/°C ± 150 ppm/°C
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 § 4.13
1.5 Pr/5 s
Us 1.5 U
L
± (0.25 % + 0.005 Ω)
Rapid Temperature Change
IEC 60115-1
Te sts Na
5 cycles - 1 h
- 55 °C to + 150 °C
± (0.5 % + 0.005 Ω)
Load Life
IEC 60115-1
1000 h Pr at + 25 °C case temperature
± (1 % + 0.005 Ω)
Humidity (Steady State)
IEC 60115-1
IEC 60068-2-3
Test Ca: 56 days RH 95 % 85 °C
± (0.5 % + 0.005 Ω)
Vibration
IEC 60115-1
IEC 60068-2-6
Test Fc: 10 to 2000 Hz
± (0.2 % + 0.005 Ω)
Shear (Adhesion) Test
IEC 60115-1
IEC 60068-2-21
Test Ue3/Shear: 5 N/10 s
No visible damage
Substrate Bending Test
IEC 60115-1
IEC 60068-2-21
Test Ue1: 2 mm/3 times
± (0.25 % + 0.005 Ω)
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
IEC 60115-1
IEC 60068-2-58
Solder Bath method: 270 °C/10 s
± (0.5 % + 0.005 Ω)
Moisture Sensitivity Level (MSL)
IPC/JEDEC J-STD-020C
85 °C/85 % RH/168 h
Level: 1
+ Pass requirements of TCR
Overload and Dielectic Strength after MSL
50
25
0
100
CASE TEMPERATURE IN °C
% OF RATED DISSIPATION
80
60
40
20
0
100 150 200