Instruction Manual

CM200DX-24S
Dual IGBTMOD™ NX-S Series Module
200 Amperes/1200 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 [phone] www.pwrx.com
4 06/11 Rev. 2
Electrical Characteristics, T
j
= 25°C unless otherwise specied (continued)
NTC Thermistor Part
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance R
25
T
C
= 25°C
*2
4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R T
C
= 100°C, R
100
= 493Ω -7.3 — +7.8 %
B Constant B
(25/50)
Approximate by Equation
*6
— 3375 — K
Power Dissipation P
25
T
C
= 25°C
*2
— — 10 mW
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case
*2
R
th(j-c)
Q Per Inverter IGBT — — 0.10 K/W
Thermal Resistance, Junction to Case
*2
R
th(j-c)
D Per Inverter FWDi — — 0.19 K/W
Contact Thermal Resistance, R
th(c-f)
Thermal Grease Applied — 0.015 — K/W
Case to Heatsink
*2
(Per 1 Module)
*7
Mechanical Characteristics
Mounting Torque M
t
Main Terminals, M6 Screw 31 35 40 in-lb
M
s
Mounting to Heatsink, M5 Screw 22 27 31 in-lb
Creepage Distance d
s
Terminal to Terminal 11.55 — — mm
Terminal to Baseplate 12.32 — — mm
Clearance d
a
Terminal to Terminal 10.00 — — mm
Terminal to Baseplate 10.85 — — mm
Weight m — 350 — Grams
Flatness of Baseplate e
c
On Centerline X, Y
*8
±0 — ±100 µm
Recommended Operating Conditons, T
a
= 25°C
(DC) Supply Voltage V
CC
Applied Across C1-E2 — 600 850 Volts
Gate (-Emitter Drive) Voltage V
GE(on)
Applied Across G1-Es1 / G2-Es2 13.5 15.0 16.5 Volts
External Gate Resistance R
G
Per Switch 0 — 22 Ω
*2 Case temperature (T
C
) and heatsink temperature (T
s
) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 B
(25/50)
= In(
R
25
)/(
1
–
1
)
R
50
T
25
T
50
R
25
; Resistance at Absolute Temperature T
25
[K]; T
25
= 25 [°C] + 273.15 = 298.15 [K]
R
50
; Resistance at Absolute Temperature T
50
[K]; T
50
= 50 [°C] + 273.15 = 323.15 [K]
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
– : CONCAVE
+ : CONVEX
– : CONCAVE
X
Y
+ : CONVEX
MOUNTING
SIDE
MOUNTING SIDE
MOUNTING SIDE
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22
23
24
48
47
46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25
0 0
28.2
41.7
38.1
29.1
LABEL SIDE
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
Th
0
27.9
37.4
41.4
78.4
Tr 2
Di2
Tr 1
Di1