Specifications

SHENZHENSHI XINZHONGXIN TECHNOLOGY CO., LTD.
ADDRESS:Block 3,Dong Huan Industrial Park,Sha Jing Town,Bao’an District,Shenzhen City,
Guangdong, China
TEL:0755-29179480/81 /82 FAX: 0755-84736169 WEBWWW.C-CHIP.COM.CN
F-6988
一、Product overview ............................................................................................................................................... 4
二、Application area ................................................................................................................................................. 4
三、Features .............................................................................................................................................................. 4
四、performance parameter ..................................................................................................................................... 5
五、Module block diagram ....................................................................................................................................... 6
六、The size of the module graph ............................................................................................................................ 7
七、Module packaging material height dimensions: ................................................................................................... 8
八、Device pin out diagrm ...................................................................................................................................... 9
九、Pin definition .................................................................................................................................................... 9
十、Design notes ..................................................................................................................................................... 11
十一、N otes .......................................................................................................................................................... 11
十二、Recommended reflow temperature ............................................................................................................ 12
十三、Application schematic diagram ................................................................................................................... 12