Specifications

Escala Tower PL & S, E, T System Hardware
Chapter 3: External Storage and SAN Subsystems 11/116
9es3s1c3.doc
Rev 5.9
02/12/2003
MTBF
9 GB, 10K rpm 1,000,000 h
18 GB, 10K rpm 1,200,000 h
36 GB, 10K rpm 1,200,000 h
72 GB, 10K rpm 1,200,000 h
2.1.3. DAE Enclosure
CABG024/CABG026/DRWG010 Discontinued : December 31, 2003
2.1.3.1. Overview
The
DAE
(Disk-Array Enclosure) is a 10-slot enclosure without RAID capabilities (no SPs), playing
the role of the capacity building block. Several enclosures can be chained to create larger
configurations.
The figure below summarizes the hardware architecture of a DAE enclosure. A DAE contains at least
one Fibre Channel loop. The hardware to implement the second FC-AL loop is optional. Individual
hardware components are discussed later in this document.
AC Branch A
AC Branch B
Power
Supply
A
Power
Supply
B
Redundant
Fan
Module
SP A SP B
Dual-ported Drives
Fibre Channel
Circuitry A
Fibre Channel
Circuitry B
The DAE components include:
•
One or two LCCs (Link Controller Cards, shown as “fibre channel circuitry” in the figure above)
to implement one or two FC-AL loops.
•
Up to 10 fibre channel dual port disk modules.
•
One or two power supplies each with its own power cord.
•
One redundant fan module to cool the disks.
All these components can be replaced under power.