Datasheet

Revision history STM32F103xx
82/84
22-Nov-2007 4
Document status promoted from preliminary data to datasheet.
The STM32F103xx is USB certified. Small text changes.
Power supply schemes on page 10 modified. Number of
communication peripherals corrected for STM32F103Tx and number of
GPIOs corrected for LQFP package in Table 2: Device features and
peripheral counts (STM32F103xx performance line).
Main function and default alternate function modified for PC14 and
PC15 in, Note 5 added and Remap column added in Ta bl e 3 : P i n
definitions.
V
DD
–V
SS
ratings and Note 1 modified in Table 4: Voltage
characteristics, Note 1 modified in Table 5: Current characteristics.
Note 1 and Note 2 added in Table 9: Embedded reset and power
control block characteristics.
I
DD
value at 72 MHz with peripherals enabled modified in Tab l e 1 2 :
Maximum current consumption in Run mode, code with data
processing running from RAM.
I
DD
value at 72 MHz with peripherals enabled modified in Tab l e 1 3 :
Maximum current consumption in Sleep mode, code running from
Flash or RAM.
I
DD_VBAT
typical value at 2.4 V modified and I
DD_VBAT
maximum values
added in Table 14: Typical and maximum current consumptions in Stop
and Standby modes. Note added in Table 15 on page 39 and Table 16
on page 40. ADC1 and ADC2 consumption and notes modified in
Table 18: Peripheral current consumption.
t
SU(HSE)
and t
SU(LSE)
conditions modified in Tabl e 21 and Tabl e 22,
respectively.
Maximum values removed from Table 25: Low-power mode wakeup
timings. t
RET
conditions modified in Table 28: Flash memory endurance
and data retention. Figure 11: Power supply scheme corrected.
Figure 16: Current consumption in Stop mode with regulator in Low-
power mode versus temperature at VDD = 3.3 V and 3.6 V added.
Note removed below Figure 25: SPI timing diagram - slave mode and
CPHA = 0. Note added below Figure 26: SPI timing diagram - slave
mode and CPHA = 1(1).
Details on unused pins removed from General input/output
characteristics on page 53.
Table 40: SPI characteristics updated. Table 41: USB startup time
added. V
AIN
, t
lat and
t
latr
modified, note added and I
lkg
removed in
Table 44: ADC characteristics. Test conditions modified and note added
in Table 47: ADC accuracy. Note added below Ta ble 45 and Tabl e 48 .
Inch values corrected in Table 51: LQPF100, 100-pin low-profile quad
flat package mechanical data, Table 52: LQFP64, 64-pin low-profile
quad flat package mechanical data and Table 53: LQFP48, 48-pin low-
profile quad flat package mechanical data.
Θ
JA
value for VFQFPN36 package added in Table 54: Thermal
characteristics.
Order codes replaced by Section 7: Ordering information scheme.
MCU ‘s operating conditions modified in Typical current consumption
on page 38. Avg_Slope and V
25
modified in Ta bl e 48 : T S
characteristics. I2C interface characteristics on page 58 modified.
Impedance size specified in A.4: Voltage glitch on ADC input 0 on
page 81.
Table 56. Document revision history (continued)
Date Revision Changes