System information

Dell
PowerEdge M910 Technical Guide iii
Table of Contents
1 Product Comparison ........................................................................................... 6
1.1 Overview .................................................................................................. 6
1.2 Powerful Performance................................................................................... 6
1.3 Scaling Capability ........................................................................................ 6
1.4 High Reliability ........................................................................................... 6
1.5 Product Comparison ..................................................................................... 7
2 Key Technologies ............................................................................................. 10
2.1 Overview ................................................................................................ 10
2.2 Detailed Information .................................................................................. 10
2.2.1 Intel 7510 Chipset ................................................................................ 10
2.2.2 Intel Xeon Processor E7 Family ................................................................. 10
2.2.3 FlexMem Bridge .................................................................................. 11
2.2.4 IO Hub (IOH) with Intel QuickPath Architecture ............................................. 11
2.2.5 DDR3 Memory ..................................................................................... 11
2.2.6 PCI Express Generation 2 ....................................................................... 11
2.2.7 Internal Redundant SD Module ................................................................. 11
2.2.8 iDRAC6 Express ................................................................................... 11
3 System Information .......................................................................................... 12
3.1 Overview ................................................................................................ 12
3.2 Product Features Summary ........................................................................... 12
4 Mechanical .................................................................................................... 14
4.1 Overview ................................................................................................ 14
4.2 Module Dimensions and Weight ...................................................................... 14
4.3 Front View and Features .............................................................................. 15
4.4 Back View and Features ............................................................................... 16
4.5 Power Supply Indicators ............................................................................... 16
4.6 LED Indicators .......................................................................................... 16
4.7 Internal-Chassis View .................................................................................. 17
4.8 Rails and Cable Management ......................................................................... 17
4.9 Fans ...................................................................................................... 17
4.10 Cabling ................................................................................................... 17
4.11 Control Panel/LCD ..................................................................................... 17
4.12 Security .................................................................................................. 17
4.13 Cover Latch ............................................................................................. 18
4.14 TPM (Trusted Platform Module) ...................................................................... 18
4.15 Power Off Security ..................................................................................... 18
4.16 USB Key .................................................................................................. 18
4.17 Battery ................................................................................................... 18
4.18 Field Replaceable Units (FRU)........................................................................ 18
4.19 User Accessible Jumpers, Sockets, and Connectors ............................................... 18
5 Power, Thermal, and Acoustic ............................................................................. 19
5.1 Power Efficiency ....................................................................................... 19
5.2 Thermal.................................................................................................. 19
5.3 Acoustics ................................................................................................ 20
5.4 Environmental Specifications......................................................................... 20
6 Processors ..................................................................................................... 22
6.1 Overview ................................................................................................ 22
6.2 Features ................................................................................................. 22
6.3 Supported Processors .................................................................................. 23
6.4 Processor Configurations .............................................................................. 24