System information

Dell
PowerEdge M1000e Technical Guide iii
Table of Contents
1 Product Comparison ........................................................................................... 6
2 Key Technologies ............................................................................................... 8
2.1 Overview .................................................................................................. 8
2.2 Detailed Information .................................................................................... 8
3 System Information .......................................................................................... 10
3.1 Overview ................................................................................................ 10
3.2 Product Features Summary ........................................................................... 10
4 Mechanical .................................................................................................... 11
4.1 Chassis Description..................................................................................... 11
4.2 Dimensions .............................................................................................. 11
4.3 Front View and Features .............................................................................. 11
4.4 Back View and Features ............................................................................... 13
4.5 Power Supply Indicators ............................................................................... 14
4.6 Rails and Cable Management ......................................................................... 14
4.7 Rack Support ............................................................................................ 15
4.8 Rack View ............................................................................................... 15
4.9 Fans ...................................................................................................... 16
4.10 Cabling ................................................................................................... 20
4.11 Control Panel/LCD ..................................................................................... 21
4.12 Security .................................................................................................. 23
5 Power, Thermal, Acoustic .................................................................................. 24
5.1 Power Supplies ......................................................................................... 24
5.1.1 2360 Watt Power Supplies ...................................................................... 26
5.1.2 2700 Watt Power Supplies ...................................................................... 26
5.2 Power Redundancy Options ........................................................................... 27
5.2.1 Supported Redundancy Options in CMC 3.0 .................................................. 27
5.2.2 Power Tables for Redundancy Options ........................................................ 27
5.2.3 Power Supply Combinations .................................................................... 28
5.2.4 Chassis Behavior When Powering Up Power Supplies ....................................... 29
5.2.5 CMC Revisions and Power Supply Compatibility ............................................. 29
5.2.6 Recommended Number of Servers ............................................................. 30
5.3 Power Management .................................................................................... 33
5.4 Power Supply Specifications .......................................................................... 35
5.5 Heat Dissipation ........................................................................................ 35
5.6 Environmental Specifications......................................................................... 38
5.7 Power Consumption .................................................................................... 38
5.8 Maximum Input Amps .................................................................................. 38
5.9 Power-Up Sequence ................................................................................... 38
5.10 Acoustics ................................................................................................ 39
6 Processors and Memory ..................................................................................... 40
7 Midplane ....................................................................................................... 41
8 Embedded NICs/LAN on Motherboard (LOM) ............................................................. 44
9 Input/Output (I/O) ........................................................................................... 45
9.1 Overview ................................................................................................ 45
9.2 Quantities and Priorities .............................................................................. 45
9.3 Supported Mezzanine Cards and Switches .......................................................... 48
9.4 I/O Module Installation ................................................................................ 49
9.5 FlexAddress ............................................................................................. 49