Datasheet

9
Figure 10. Recommended reflow soldering profile.
Figure 12. Recommended soldering pattern
for HSMW-C191, HSMW-C130, and
HSMW-C197.
Figure 13. Recommended soldering pad
pattern for HSMW-C265.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.25 (0.049)
1.4
(0.055)
1.4
(0.055)
2.3
(0.091)
2.2 (0.087) DIA. PCB HOLE
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS (INCHES).
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
Figure 14. Recommended soldering pad
pattern for HSMW-C120.
Figure 11. Recommended Pb-free reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
TEMPERATURE