Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesN/Amcd White 0603 Chip LED, HSMW-C191,

Description

These white ChipLEDs come in unique shades of white

and provide product dierentiation for backlighting

application. They are designed in industry standard

package for ease of handling and use.

These chipLEDs come in either a side emitting package

(HSMW-C120) or in top emitting packages (HSMW-

C130, C191, C197 and C265).

The packages all compatible with IR reow soldering

process and come in 8 mm tape on 7" diameter reel.

They are compatible with automatic placement equip-

ment.

In order to facilitate pick and place operation, these chi-

pLEDs are shipped in tape and reel with 4000 units per

reel for HSMW-C120, C130, C191 and C197 packages,

and 3000 units per reel for HSMW-C265 package.

Features

x White color

x Small size

x Industry standard footprint

x Compatible with reow soldering

x Compatible with automatic placement equipment

x Operating temperature range –40qC to +85qC

x Come in 8 mm tape on 7" diameter reels

Applications

x LCD backlighting

x Keypad backlighting

x Pushbutton backlighting

x Symbol backlighting

HSMW-C120, HSMW-C130, HSMW-C191,

HSMW-C197, HSMW-C265

White ChipLEDs

Data Sheet

CAUTION: HSMW-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions

during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

Summary of content (11 pages)

PAGE 1
HSMW-C120, HSMW-C130, HSMW-C191, HSMW-C197, HSMW-C265 White ChipLEDs Data Sheet Description Features These white ChipLEDs come in unique shades of white and provide product differentiation for backlighting application. They are designed in industry standard package for ease of handling and use. x White color These chipLEDs come in either a side emitting package (HSMW-C120) or in top emitting packages (HSMWC130, C191, C197 and C265).
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Package Dimensions CATHODE MARK LED Die 0.8 0.031 LED DIE 0.3 (0.012) (0.80) 0.6 (0.024) 1.6 0.063 1.6 (0.063) Polarity 1.15 0.045 POLARITY 1.2 (0.047) DIFFUSED EPOXY 0.23 0.009 DIFFUSED EPOXY 0.35 0.014 PCB BOARD 1.0 (0.039) PC BOARD 0.12 0.005 0.5 (0.020) CATHODE LINE CATHODE LINE 0.3±0.15 0.012±.006 0.3±0.15 0.012±.006 3 Ð 0.3 (0.012) 0.7 MIN. 0.028 SOLDERING TERMINAL SOLDERING TERMINAL HSMW-C120 HSMW-C130 CATHODE MARK LED DIE LED DIE 0.8 (0.031) 1.6 (0.063 ) 1.0 (0.039) 0.
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Package Dimensions, continued CATHODE MARK LED DIE 1.25 (0.049) 3.4 (0.134 ) DIFFUSED EPOXY POLARITY 1.2 (0.047) 1.1 (0.043) 1.1 (0.043) PC BOARD 0.3 (0.012) CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) SOLDERING TERMINAL HSMW-C265 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 2. TOLERANCE ±0.1 mm UNLESS OTHERWISE NOTED.
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Device Selection Guide Package Dimension (mm) White Package Description 1.6 (L) x 0.6 (W) x 1.0 (H) HSMW-C120 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.35 (H) HSMW-C130 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.6 (H) HSMW-C191 Untinted, Diffused 1.6 (L) x 0.8 (W) x 0.4 (H) HSMW-C197 Untinted, Diffused 3.4 (L) x 1.25 (W) x 1.1 (H)[2] HSMW-C265 Untinted, Diffused Notes: 1. Right angle package. 2. Reverse mount package.
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Light Intensity (Iv) Bin Limits[1] Bin ID Intensity (mcd) Min. Max. Bin Limits (Chromaticity Coordinate) x y A 0.11 0.18 A1 0.270 0.246 B 0.18 0.29 0.270 0.278 0.250 0.250 0.250 0.218 0.270 0.246 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 0.270 0.213 G 1.80 2.80 0.250 0.185 0.250 0.218 0.270 0.246 0.278 H 2.80 4.50 J 4.50 7.20 A2 B1 K 7.20 11.20 0.270 L 11.20 18.00 0.290 0.306 0.290 0.274 0.270 0.246 71.50 0.270 0.213 M 18.00 28.
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0.40 SMT WHITE COLOR BIN STRUCTURES 100 0.36 0.34 0.32 0.30 0.28 0.26 0.24 0.22 0.20 0.18 0.16 0.24 IF - FORWARD CURRENT - mA Y-COORDINATE 0.38 D1 C1 B1 A1 D2 C2 B2 A2 0.26 0.28 0.30 0.32 10 1 0.1 0.34 2.0 3.0 2.5 Figure 3. Luminous intensity vs. forward current.
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100 90 RELATIVE INTENSITY - % 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 20 30 40 50 60 70 80 90 2 0 3 0 40 50 60 70 80 9 0 Figure 6. Relative intensity vs. angle for HSMW-C130. 100 RELATIVE INTENSITY - % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 Figure 7. Relative intensity vs. angle for HSMW-C191.
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TEMPERATURE 10 SEC. MAX. TEMPERATURE 10 SEC. MAX. 230 C MAX. 4 C/SEC. MAX. 140-160 C 217 C 200 C 255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 150 C 3 C/SEC. MAX. 3 C/SEC. MAX. 4 C/SEC. MAX. 60 SEC. MAX. 60 - 120 SEC. OVER 2 MIN. TIME TIME Figure 11. Recommended Pb-free reflow soldering profile. Figure 10. Recommended reflow soldering profile. 0.4 (0.016) 0.4 (0.016) 0.8 (0.031) 0.7 (0.028) 0.15 (0.006) 0.8 (0.031) 1.2 (0.047) 0.8 (0.031) CENTERING BOARD Figure 12.
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USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 15. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 16. Reel dimensions. NOTE: 1. DIMENSIONS ARE IN MILLIMETERS (INCHES). 9 6 PS 5.0 ± 0.5 (0.197 ± 0.
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4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) 4.00 (0.157) HSMx-C120 POSITION IN CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C120 SERIES HSMx-C130 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION DIM. A DIM.
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END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 18. Tape leader and trailer dimensions. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.