Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesN/Amcd Red 0603 Chip LED, HSMS-C191,

Description

These chip LEDs are designed in an industry standard

package for ease of handling and use. Various diﬀerent

LED colors are available in nine compact, single color

packages.

The HSMx-C150 has the industry standard 3.2 x 1.6

mm footprint that is excellent for all around use. The

HSMx-C170 has the widely used 2.0 x 1.25 mm foot-print

with 0.8 mm proﬁle. The HSMx-C177 has the widely

used 2.0 x 1.25 mm footprint with 0.4 mm proﬁle. The

HSMx-C19x series has the industry standard 1.6 x 0.8 mm

footprint with varying proﬁle to suit designers needs, the

HSMx-C190 has 0.8 mm proﬁle, the HSMx-C191 has a low

proﬁle of 0.6 mm, and the HSMx-C197 has the ultra low

proﬁle of 0.4 mm. This family with its thin proﬁle and wide

viewing angle makes this LED exceptional for backlight-

ing applications.

The HSMx-C110 is a right angle package with the uni-

versally accepted dimensions of 3.2 x 1.0 x 1.5 mm. The

HSMx-C120 is a smaller right angle package with industry

standard 1.6 x 0.6 x 1.0 mm. HSMx-C265 is a reverse

mount package with dimensions of 3.4 x 1.25 x 1.1 mm.

These devices are ideal for LCD backlighting and side-

lighting applications.

In order to facilitate pick and place operation, these

chip LEDs are shipped in tape and reel with 4000 units

per reel for HSMx-C120, C170, C177, C190, C191, C197

packages, and 3000 units per reel for HSMx-C110, C150,

C265 packages.

All packages are compatible with IR reflow solder

processes. The small size and wide viewing angle make

these LEDs prime choices for backlighting applications

and front panel illumination especially where space is a

premium.

HSMx-C110/C120/C150/C170/C177/C190/C191/C197/C265

Features

• Small size

• Industry standard footprint

• Compatible with IR solder

• Diﬀused optics

• Operating temperature range of -30°C to +85°C

• Right angle & reverse mount package available

• Various colors available

• Available in 8 mm tape on 7 in. (178 mm) diameter

reels

Applications

• Keypad backlighting

• Push-button backlighting

• LCD backlighting

• Symbol backlighting

• Front panel indicator

HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx,

HSMS-Cxxx, HSMY-Cxxx,

Surface Mount Chip LEDs

Data Sheet

Summary of content (12 pages)

PAGE 1
HSMD-Cxxx, HSMG-Cxxx, HSMH-Cxxx, HSMS-Cxxx, HSMY-Cxxx, Surface Mount Chip LEDs Data Sheet HSMx-C110/C120/C150/C170/C177/C190/C191/C197/C265 Description Features These chip LEDs are designed in an industry standard package for ease of handling and use. Various different LED colors are available in nine compact, single color packages. • Small size The HSMx-C150 has the industry standard 3.2 x 1.6 mm footprint that is excellent for all around use. The HSMx-C170 has the widely used 2.0 x 1.
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Device Selectiion Guide GaP Green HSMG-C110 HSMG-C120 HSMG-C150 HSMG-C170 HSMG-C177 HSMG-C190 HSMG-C191 HSMG-C197 HSMG-C265 HER HSMS-C110 HSMS-C120 HSMS-C150 HSMS-C170 HSMS-C177 HSMS-C190 HSMS-C191 HSMS-C197 – Orange HSMD-C110 HSMD-C120 HSMD-C150 HSMD-C170 HSMD-C177 HSMD-C190 HSMD-C191 HSMD-C197 – Yellow HSMY-C110 – HSMY-C150 HSMY-C170 HSMY-C177 HSMY-C190 HSMY-C191 HSMY-C197 – Description Untinted, Non-Diffused Untinted, Non-Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Dif
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CATHODE MARK (ANODE MARK FOR HSMH-C190) CATHODE LINE LED DIE (ANODE MARK FOR HSMH-C110) 1.0 (0.039) 0.8 (0.031) 2.6 (0.102 ) 1.6 (0.063 ) 3.2 (0.126 ) 1.0 (0.039) POLARITY[3] CLEAR EPOXY POLARITY[3] 0.3 (0.012) 1.5 (0.059) DIFFUSED EPOXY PC BOARD PC BOARD 1.6 (0.063 ) 0.8 (0.031) 0.3 (0.012) CATHODE LINE (ANODE LINE FOR HSMH-C190) 0.3 ± 0.15 (0.012 ± 0.006) 0.5 (0.020) 3.2 (0.126 ) 0.3 ± 0.15 (0.012 ± 0.006) CATHODE LINE (ANODE LINE FOR HSMH-C110) 0.8 (0.031) 1.0 (0.039) 0.7 (0.
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3.4 (0.134) CATHODE MARK (ETCHED) [ANODE MARK FOR HSMH-C265] LED DIE CATHODE MARK 1.25 (0.049) 0.80 (0.031) GREEN SOLDER MASK 1.60 (0.063) POLARITY[3] 1.2 (0.047) UNDIFFUSED EPOXY POLARITY DIFFUSED EPOXY 1.1 (0.043) 1.1 (0.043) 0.40 (0.016) PC BOARD PC BOARD CATHODE LINE (ANODE LINE FOR HSMH-C265) 0.16 (0.006) 0.3 (0.012) CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.30 ± 0.15 (0.012 ± 0.006) 0.70 (0.028) MIN.
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Absolute Maximum Ratings for GaP at TA=25°C Parameter DC Forward Current[1] Power Dissipation Reverse Voltage (IR=100 µA) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature C110/150/265 25 65 5 95 -30 to +85 -40 to +85 C120/170/177/190/191/197 20 52 5 95 -30 to +85 -40 to +85 See reflow soldering profile (Figure 9 & 10) Absolute Maximum Ratings for AlGaAs at TA=25°C Parameter C110/150 C120/170/190/191/265 DC Forward Current[1] 30 25 Power Dissipatio
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Optical Characteristics at TA=25°C Luminous Peak Dominant Intensity[1] Wavelength Wavelength Part Number Color Iv(mcd)@20mA λpeak(nm) λd(nm) Min. Typ. Typ. Typ. HSMG-C110/177/197 Green 4.5 15.0 570 572 HSMG-C120 HSMG-C150/170/190/191/265 HSMS-C110/177/197 HER 2.8 10.0 630 626 HSMS-C120 HSMS-C150/170/190/191 HSMD-C110/177/197 Orange 2.8 8.0 605 604 HSMD-C120 HSMD-C150/170/190/191 HSMY-C110/177/197 Yellow 2.8 8.
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Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. Bin ID A 0.11 0.18 N B 0.18 0.29 P C 0.29 0.45 Q D 0.45 0.72 R E 0.72 1.10 S F 1.10 1.80 T G 1.80 2.80 U H 2.80 4.50 V J 4.50 7.20 W K 7.20 11.20 X L 11.20 18.00 Y M 18.00 28.50 Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Note: 1. Bin categories are established for classification of products.
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1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 RELATIVE INTENSITY – % 0.90 0.80 HSMx-C190 fig 5a 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110.
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100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C177 and C197. 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative intensity vs. angle for HSMx-C150, C170, C190, C191 and C265. HSMx-C190 fig 6 TEMPERATURE 10 - 30 SEC. TEMPERATURE 10 SEC. MAX. 230°C MAX.
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5.0 (0.200) 0.9 (0.035) 0.4 (0.016) 0.9 (0.035) 0.4 (0.016) 1.0 (0.039) 0.2 (0.008) 0.7 (0.028) 0.15 (0.006) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) 0.8 (0.031) Figure 14. Recommended soldering pattern for HSMx-C110. 1.2 (0.047) 0.8 (0.031) CENTERING BOARD Figure 15. Recommended soldering pattern for HSMx-C120. USER FEED DIRECTION 2.2 (0.087) DIA. PCB HOLE CATHODE SIDE 1.25 (0.049) 1.4 (0.055) 2.3 (0.091) 1.4 (0.055) PRINTED LABEL Figure 16.
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4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) HSMx-C110/C120 POSITION IN CARRIER TAPE COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMx-C110 SERIES HSMx-C120 SERIES HSMx-C150 SERIES HSMx-C170 SERIES HSMx-C177 SERIES HSMx-C190 SERIES HSMx-C191 SERIES HSMx-C197 SERIES DIM.
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END THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. START MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 20. Tape leader and trailer dimensions. Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components.