Datasheet

9
Figure 8. Relative intensity vs. angle for HSMx-C150, C170, C190, C191 and C265.
Figure 10. Recommended Pb-free reflow soldering profile.
HSMx-C190 fig 6
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50
-30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50
-30 02030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 11. Recommended soldering pattern for HSMx-
C150.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
HSMX-C190 fig 8
Figure 13. Recommended soldering pattern for HSMx-C190,
C191 and C197.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
HSMX-C190 fig 10
Figure 12. Recommended soldering pattern for HSMx-C170
and C177.
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
HSMX-C190 fig 9
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
Figure 9. Recommended reflow soldering profile.
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
TEMPERATURE