Datasheet

9
Figure 8. Relative intensity vs. angle for HSMx-C150, C170, C190, C191 and C265.
Figure 10. Recommended Pb-free re ow soldering pro le.
RELATIVE INTENSITY – %
1.00
0
ANGLE
0.80
0.60
0.50
0.70
0.20
0.10
0.30
0.40
0.90
-70 -50
-30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
Figure 7. Relative intensity vs. angle for HSMx-C177 and C197.
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50
-30 0 2030507090-90 -20-80 -60 -40 -10 10 40 60 80
Figure 11. Recommended soldering pattern
for HSMx-C150.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
Figure 13. Recommended soldering pattern
for HSMx-C190, C191 and C197.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 12. Recommended soldering
pattern for HSMx-C170 and C177.
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
Figure 9. Recommended re ow soldering pro le.
217 C
200 C
60 - 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
3 C/SEC. MAX.
150 C
255 - 260 C
60 SEC. MAX.
10 SEC. MAX.
TIME
TEMPERATURE