Datasheet

9
Figure 12. Recommended Pb-free reflow soldering profile.
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
Figure 16. Recommended soldering pattern for HSMx-C150.
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
Figure 15. Recommended soldering pattern for HSMx-
C130/190/191/197.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 17. Recommended soldering pattern for HSMx-C120. Figure 18. Recommended soldering pattern for HSMx-C265.
0.7 (0.028)
0.8
(0.031)
0.8
(0.031)
1.2
(0.047)
0.4 (0.016)
0.15 (0.006)
0.4 (0.016)
CENTERING
BOARD
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
2.2 (0.087) DIA. PCB HOLE
Figure 11. Recommended reflow soldering profile.
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
217 C
200 C
60 - 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
3 C/SEC. MAX.
150 C
255 - 260 C
60 SEC. MAX.
10 SEC. MAX.
TIME
TEMPERATURE