Datasheet

4
Absolute Maximum Ratings at T
A
= 25˚C
HSMQ-Cxxx
Parameter HSMR-Cxxx Units
DC Forward Current
[1]
20 mA
Power Dissipation 78 mW
Reverse Voltage (I
R
= 100 µA) 5 V
LED Junction Temperature 95 ˚C
Operating Temperature Range –40 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figures 11 & 12)
Device Selection Guide
Package Dimension (mm)
[1], [2]
InGaN Green InGaN Blue Package Description
3.2(L) x 1.5(W) x 1.0(H) HSMQ-C110 HSMR-C110 Untinted, Non-diffused
1.6(L) x 1.0(W) x 0.6(H) HSMQ-C120 HSMR-C120 Untinted, Non-diffused
1.6(L) x 0.8(W) x 0.35(H) – HSMR-C130 Untinted, Diffused
3.2(L) x 1.6(W) x 1.1(H) HSMQ-C150 HSMR-C150 Untinted, Diffused
2.0(L) x 1.25(W) x 0.8(H) HSMQ-C170 HSMR-C170 Untinted, Diffused
2.0(L) x 1.25(W) x 0.4(H) HSMQ-C177 HSMR-C177 Untinted, Diffused
1.6(L) x 0.8(W) x 0.8(H) HSMQ-C190 HSMR-C190 Untinted, Diffused
1.6(L) x 0.8(W) x 0.6(H) HSMQ-C191 HSMR-C191 Untinted, Diffused
1.6(L) x 0.8(W) x 0.4(H) HSMQ-C197 HSMR-C197 Untinted, Diffused
3.4(L) x 1.25(W) x 1.1(H) HSMQ-C265 HSMR-C265 Untinted, Non-diffused
Notes: 1. Dimensions in mm. 2. Tolerance ± 0.1 mm unless otherwise noted.
Note: 1. Derate linearly as shown in Figure 4.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
Package Dimensions, continued
1.6
(0.063)
0.12 (0.005)
0.3 ± 0.15
(0.012 ± 0.006)
0.23 (0.009)
CATHODE
MARK
0.35 (0.014)
0.3 ± 0.15
(0.012 ± 0.006)
1.15
(0.045)
LED DIE
DIFFUSED EPOXY
PCB BOARD
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.
POLARITY
(0.625)
SOLDERING
TERMINAL
HSMx-C130
3.4 (0.134)
0.3 (0.012)
0.50 ± 0.15
(0.020 ± 0.006)
1.1 (0.043)
POLARITY
CATHODE
MARK (ETCHED)
1.1 (0.043)
0.50 ± 0.15
(0.020 ± 0.006)
1.2
(0.047)
1.25 (0.049)
LED DIE
UNDIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
GREEN SOLDER MASK
CATHODE LINE
HSMx-C265