Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED 1608 Green 145 mcd 140 ° 20 mA 3.4 V

Features

• High brightness

• Small size

• Industrial standard footprint

• Diffused optics

• Top emitting or right angle emitting

• Compatible with IR soldering

• Compatible for use with light piping

• Available in 8 mm tape on 7" diameter reel

• Reel sealed in zip locked moisture barrier bags

Applications

• LCD backlighting

• Push button backlighting

• Front panel indicator

• Symbol indicator

• Microdisplays

• Small message panel signage

Description

These small chip-type LEDs utilize high efficient and

high brightness InGaN material to deliver competitively

priced high performance blue and green. These 520

nm green and 470 nm blue are unique hues which

provide color differentiation to a product.

These ChipLEDs come in either top emitting packages

(HSMx-C130, C150, C170, C177, C190, C191, C197),

in side emitting packages (HSMx-C110, C120) or in a

reverse mount package (C265). The side emitting

package is especially suitable for LCD backlighting

application. The top emitting packages, with their

wide viewing angle, are suitable for direct backlighting

application or being used with light pipes. In order to

facilitate pick and place operation, these ChipLEDs

are shipped in tape and reel with 4000 units per reel for

HSMx-C120, C130, C170, C177, C190, C191 and

C197 packages, and 3000 units per reel for HSMx-

C110, C150 and C265 packages. All packages are

compatible with IR soldering and binned by both color

and intensity.

HSMQ-C110, HSMQ-C120, HSMQ-C150,

HSMQ-C170, HSMQ-C177, HSMQ-C190,

HSMQ-C191, HSMQ-C197, HSMQ-C265,

HSMR-C110, HSMR-C120, HSMR-C130,

HSMR-C150, HSMR-C170, HSMR-C177,

HSMR-C190, HSMR-C191, HSMR-C197,

HSMR-C265

CAUTION: HSMQ-Cxxx and HSMR-Cxxx LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please

observe appropriate precautions during handling and processing. Refer to Avago Technologies Application

Note AN-1142 for additional details.

HSMx-C1xx

High Performance Chip LED

Data Sheet

Summary of content (12 pages)

PAGE 1
HSMx-C1xx High Performance Chip LED Data Sheet HSMQ-C110, HSMQ-C120, HSMQ-C150, HSMQ-C170, HSMQ-C177, HSMQ-C190, HSMQ-C191, HSMQ-C197, HSMQ-C265, HSMR-C110, HSMR-C120, HSMR-C130, HSMR-C150, HSMR-C170, HSMR-C177, HSMR-C190, HSMR-C191, HSMR-C197, HSMR-C265 Description Features These small chip-type LEDs utilize high efficient and high brightness InGaN material to deliver competitively priced high performance blue and green.
PAGE 2
Package Dimensions CATHODE LINE LED DIE CATHODE MARK 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 2.0 (0.079 ) 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.4 (0.055) DIFFUSED EPOXY 1.5 (0.059) POLARITY 0.3 (0.012) PC BOARD PC BOARD 0.8 (0.031) 1.6 (0.063 ) 0.5 (0.020) 3.2 (0.126 ) 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C170 HSMx-C110 CATHODE MARK CATHODE MARK 0.8 (0.031) 0.8 (0.
PAGE 3
Package Dimensions, continued CATHODE MARK CATHODE MARK 1.25 (0.049) 1.6 (0.063) 2.00 (0.079) 3.2 (0.126 ) POLARITY DIFFUSED EPOXY POLARITY 2.0 (0.079) DIFFUSED EPOXY 0.40 (0.016) 0.6 (0.024) 1.1 (0.043) PC BOARD PC BOARD CATHODE LINE 0.16 (0.006) 0.5 (0.020) 0.50 ± 0.20 (0.020 ± 0.008) 0.50 ± 0.20 (0.020 ± 0.008) CATHODE LINE 0.40 ± 0.15 (0.016 ± 0.006) 0.40 ± 0.15 (0.016 ± 0.006) 1.10 (0.043) MIN.
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Package Dimensions, continued 3.4 (0.134) CATHODE MARK (ETCHED) CATHODE MARK LED DIE LED DIE 0.8 (0.031) 1.25 (0.049) (0.625) 1.6 (0.063) GREEN SOLDER MASK POLARITY UNDIFFUSED EPOXY POLARITY 1.15 (0.045) 1.2 (0.047) 0.23 (0.009) DIFFUSED EPOXY 1.1 (0.043) 1.1 (0.043) PC BOARD 0.3 (0.012) 0.35 (0.014) ;; PCB BOARD 0.12 (0.005) CATHODE LINE CATHODE LINE 0.50 ± 0.15 (0.020 ± 0.006) 0.50 ± 0.15 (0.020 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.3 ± 0.15 (0.012 ± 0.006) 0.7 (0.028) MIN.
PAGE 5
Electrical Characteristics at TA = 25˚C Part Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ–PIN (˚C/W) Typ. HSMQ-C110/C150 HSMR-C110/C150 HSMQ-C120 HSMR-C120/C130 HSMQ-C170/C190/C191 HSMR-C170/C190/C191 HSMQ-C177/C197 HSMR-C177/C197 HSMQ-C265 HSMR-C265 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.4 3.
PAGE 6
Light Intensity (Iv) Bin Limits[1] Bin ID A B C Intensity (mcd) Min. Max. 0.11 0.18 0.18 0.29 0.29 0.45 D E F G H J K L M 0.45 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 0.72 1.10 1.80 2.80 4.50 7.20 11.20 18.00 28.50 Bin ID N P Q Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 R S T U V W X Y 112.50 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 180.00 285.00 450.00 715.00 1125.00 1800.00 2850.00 4500.00 Tolerance: ±15% Notes: 1.
PAGE 7
RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 30 50 70 90 30 50 70 90 ANGLE RELATIVE INTENSITY – % 100 80 60 40 20 0 -90 -70 -50 -30 -10 10 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110.
PAGE 8
100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 7. Relative intensity vs. angle for HSMx-C177 and C197. 100 RELATIVE INTENSITY – % 90 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 8. Relative intensity vs. angle for HSMx-C130.
PAGE 9
10 SEC. MAX. 10 to 30 SEC. 255 - 260 °C 3 °C/SEC. MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX. OVER 2 MIN. TEMPERATURE TEMPERATURE 230°C MAX. 217 °C 200 °C 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. TIME 100 SEC. MAX. 60 - 120 SEC. Figure 11. Recommended reflow soldering profile. TIME (Acc. to J-STD-020C) Figure 12. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.0 (0.039) 1.2 (0.047) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.
PAGE 10
USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 19. Reeling orientation. ;; ;; ;; ;; ;;; ;; 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 20. Reel dimensions. NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 10 6 PS 5.0 ± 0.5 (0.197 ± 0.
PAGE 11
;; ;;;;;; ;; ;;;;;; ; 4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 0.23 ± 0.05 (0.009 ± 0.002) FOR HSMR-C130 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) ;;; ;;; DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION 4.00 (0.157) HSMx-C110/120 POSITION IN CARRIER TAPE DIM. A (SEE TABLE 1) DIM.
PAGE 12
END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 22. Tape leader and trailer dimensions.