Datasheet

6
Figure 8a. Recommended soldering pad pattern
Figure 8b. Recommended soldering pad pattern (TTW)
Thermal Resistance Solder Pad Area (xy)
300°C/W >16 mm
2
350°C/W >12 mm
2
470°C/W >8 mm
2
X X
0.5 (0.020)
Y
Y
1.0 (0.039)
2.0 (0.079)
2.0 (0.079)
6.0 (0.236)
3.0 (0.118)
2.8 (0.110)
6.1 (0.240)
DIMENSIONS IN mm (INCHES).
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
2.60
(0.103)
SOLDER RESIST
REPRESENTS ELECTRICAL
CONNECTIVITY BETWEEN PADS
4.50 (0.178)
Y
X
0.40 (0.016)
X
0.50
(0.020)
Y
1.10
(0.043)
1.50 (0.059)
DIMENSIONS IN mm (INCHES).