Datasheet

3
Package Dimensions, continued
Absolute Maximum Ratings at T
A
= 25˚C
HSMM-C110/C120/C170/C190/C150
Parameter HSMN-C110/C120/C170/C190/C191/C150 Units
DC Forward Current
[1]
20 mA
Power Dissipation 78 mW
Reverse Voltage (I
R
= 100 μA) 5 V
Led Junction Temperature 95 ˚C
Operating Temperature Range –40 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reow soldering prole (Figure 7)
Note:
1. Derate linearly as shown in Figure 4.
Electrical Characteristics at T
A
= 25˚C
Forward Voltage Reverse Breakdown Capacitance C Thermal
V
F
(Volts) V
R
(Volts) (pF), V
F
= 0, Resistance
@ I
F
= 20 mA @ I
R
= 100 μA f = 1 MHz RT
J–PIN
(˚C/W)
Part Number Typ. Max. Min. Typ. Typ.
HSMM-C110/C150 3.3 3.9 5 70 450
HSMN-C110/C150 3.3 3.9 5 70 450
HSMM-C120 3.3 3.9 5 45 450
HSMN-C120 3.3 3.9 5 45 450
HSMM-C170/C190 3.3 3.9 5 70 300
HSMN-C170/C190/C191 3.3 3.9 5 70 300
V
F
Tolerance: ±0.1 V.
HSMx-C150
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE
NOTES:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
HSMx-C191
1.6
(0.063 )
0.3 (0.012)
0.3 ± 0.15
(0.012 ± 0.006)
0.3 (0.012)
POLARITY
CATHODE
MARK
0.6 (0.023)
0.3 ± 0.15
(0.012 ± 0.006)
1.0
(0.039)
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINAL
0.8 (0.031)
CATHODE LINE
0.7 (0.028) MIN.