Datasheet

8
217 C
200 C
60 - 120 SEC.
6 C/SEC. MAX.
3 C/SEC. MAX.
(Acc. to J-STD-020C)
3 C/SEC. MAX.
150 C
255 - 260 C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Figure 7. Radiation Pattern.
Figure 9. Recommended wave soldering prole.
Figure 8. Recommended Pb-free reow soldering prole.
Note: For detail information on reow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
Reow soldering must not be done more than 2 times. Do observe
necessary precautions of handling moisture sensitive device as stated
in below section.
0 20
CURRENT – mA
460
480
540
DOMINANT WAVELENGTH – nm
35
500
470
510
10
490
520
25
GREEN
5 15 30
530
CYAN
BLUE
DELTA V
F
(NORMALIZED AT 25°C)
-0.3
-100
TEMPERATURE – °C
0.5
0.4
0.2
0.1
0
-0.2
15050-50
0 100
-0.1
0.3
GaP/AlGaAs/
AlInGaP
InGaN/GaN
NORMALIZED INTENSITY
1.0
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.2
0.4
-70 -50
-30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
Figure 6. Forward voltage shift vs. temperature.Figure 5. Dominant wavelength vs. forward current – InGaN devices.