Datasheet

8
Figure 8. Recommended Pb-free reow soldering prole.
Figure 9. Recommended soldering pattern for HSMx-C110.
Figure 10. Recommended soldering pattern for HSMx-C170.
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
Figure 12. Recommended soldering pattern for HSMx-C150.
5.0 (0.200)
1.0 (0.039)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
0.9 (0.035)
0.2 (0.008)
0.9 (0.035)
CENTERING
BOARD
1.2 (0.047)
1.2
(0.047)
0.9
(0.035)
1.2
(0.047)
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.5 (0.059)
1.5
(0.059)
1.5
(0.059)
2.0
(0.079)
Note: All dimensions in millimeters (inches).
Figure 7. Recommended reow soldering prole.
230°C MAX.
10 SEC. MAX.
4°C/SEC.-
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
–3°C/SEC.
217 °C
200 °C
60-120SEC.
6 ° C/SEC.MAX.
3 ° C/SEC.MAX.
3 ° C/SEC.MAX.
150 °C
255 - 260 ° C
100 SEC.MAX.
(Acc. toJ-STD-020C)
10-30SEC.
TIME
TEMPERATURE