Datasheet
10
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Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3604EN
AV02-0112EN - March 31, 2008
Figure 15. Tape dimensions.
Figure 16. Tape leader and trailer dimensions.
Convective IR Reow Soldering
For more information on IR reow
soldering, refer to Application Note
1060, Surface Mounting SMT LED
Indicator Components.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) Humidity Indicator Card is
>10% when read at 23±5°C.
b) Device exposed to factory
conditions <30°C/60% RH
more than 672 hours.
Baking recommended condition: 60
+/– 5˚C for 20 hours.
HSSM-C110
fig 14
END START
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (± 0.004)
DIM. B
± 0.10 (± 0.004)PART NUMBER
DIM. C
± 0.10 (± 0.004)
HSMx-C170 SERIES 2.30 (0.091) 1.45 (0.057) 0.95 (0.037)
HSMx-C190 SERIES 1.80 (0.071) 0.95 (0.037) 0.87 (0.034)
HSMx-C110 SERIES 3.40 (0.134) 1.70 (0.067) 1.20 (0.047)
HSMx-C191 SERIES 1.86 (0.073) 0.89 (0.035) 0.87 (0.034)
HSMx-C150 SERIES 3.50 (0.138) 1.88 (0.074) 1.27 (0.050)
HSMx-C110
POSITION IN
CARRIER TAPE
DIM. B
(SEE TABLE 1)
DIM. A
(SEE TABLE 1)
R 1.0 ± 0.05
(0.039 ± 0.002)










