Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED 0805 Orange 90 mcd 170 ° 20 mA 1.9 V

Features

• High brightness AlInGaP material

• Small size

• Industry standard footprint

• Diused optics

• Top emitting or right angle emitting

• Available in 3 colors (red, orange, amber)

• Compatible with IR soldering

• Available in 8 mm tape on 7" diameter reel

• Reel sealed in zip locked moisture barrier bags

Applications

• LCD backlighting

• Push button backlighting

• Front panel indicator

• Symbol indicator

• Microdisplays

• Small message panel signage

Description

These chip-type LEDs utilize Aluminum Indium Gallium

Phosphide (AlInGaP) material technology. The AlInGaP

material has a very high luminous eciency, capable of

producing high light output over a wide range of drive

currents. The available colors in this surface mount series

are 592 nm Amber, 605 nm Orange, 626 nm Red for AS

AlInGaP and 631 nm red for TS AlInGaP.

All packages are binned by both color and intensity,

except for red color.

These ChipLEDs come either in two top emitting

packages (HSMx-C170/C190/C191/C150) or in a side

emitting package (HSMx-C110). The right angle ChipLEDs

are suitable for applications such as LCD backlighting.

The top emitting ChipLEDs with wide viewing angle

are suitable for light piping and direct backlighting of

keypads and panels. In order to facilitate pick and place

operation, these ChipLEDs are shipped in tape and reel,

with 4000 units per reel for HSMx-C170/C190/C191 and

3000 units per reel for HSMx-C110/C150.

These packages are compatible with IR soldering

process.

HSMA-C110/C170/C190/C191/C150

HSML-C110/C170/C190/C191/C150

HSMC-C110/C170/C190/C191/C150

HSMZ-C110/C170/C190

HSMx-C110/C170/C190/C191/C150

High Performance ChipLED

Data Sheet

CAUTION: HSMA-Cxxx, HSMC-Cxxx, HSML-Cxxx and HSMZ-Cxxx LEDs are Class 1A

ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during

handling and processing. Refer to Application Note AN-1142 for additional details.

Summary of content (10 pages)

PAGE 1
HSMx-C110/C170/C190/C191/C150 High Performance ChipLED Data Sheet HSMA-C110/C170/C190/C191/C150 HSML-C110/C170/C190/C191/C150 HSMC-C110/C170/C190/C191/C150 HSMZ-C110/C170/C190 Description Features These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents.
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Package Dimensions CATHODE LINE LED DIE CATHODE MARK 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 2.0 (0.079 ) 3.2 (0.126 ) POLARITY CLEAR EPOXY 1.4 (0.055) DIFFUSED EPOXY 1.5 (0.059) PC BOARD POLARITY 0.3 (0.012) PC BOARD 1.6 (0.063 ) 0.5 (0.020) 3.2 (0.126 ) 0.8 (0.031) 0.3 (0.012) CATHODE LINE 0.4 ± 0.15 (0.016 ± 0.006) 0.8 (0.031) 0.4 ± 0.15 (0.016 ± 0.006) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 CATHODE MARK CATHODE MARK 0.8 (0.031) 0.
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Package Dimensions, continued CATHODE MARK 1.6 (0.063) 3.2 (0.126 ) DIFFUSED EPOXY POLARITY 2.0 (0.079) 0.6 (0.024) 1.1 (0.043) PC BOARD CATHODE LINE 0.50 ± 0.2 (0.020 ± 0.008) 0.5 (0.020) SOLDERING TERMINAL HSMx-C150 Device Selection Guide Footprint AS AlInGaP (mm)[1,2] Amber 1.6 x 0.8 x 0.8 HSMA-C190 2.0 x 1.25 x 0.8 HSMA-C170 3.2 x 1.5 x 1.0 HSMA-C110 1.6 x 0.8 x 0.6 HSMA-C191 3.2 x 1.6 x 1.1 HSMA-C150 0.50 ± 0.2 (0.020 ± 0.008) NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2.
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Electrical Characteristics TA = 25°C Parameter Number Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN = (°C/W) Typ. HSMA-C110 1.9 2.4 5 45 600 HSML-C110 1.9 2.4 5 45 600 HSMC-C110 1.9 2.4 5 45 600 HSMZ-C110 2.2 2.8 5 35 600 HSMA-C170/190/191/150 1.9 2.4 5 45 300 HSML-C170/190/191/150 1.9 2.
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Color Bin Limits[1] Bin ID A B C D E F Orange Color Bins[1] Dom. Wavelength (nm) Min. Max. 597.0 600.0 600.0 603.0 603.0 606.0 606.0 609.0 609.0 612.0 612.0 615.0 Bin ID A B C D E F Tolerance: ± 1 nm. Amber Color Bins[1] Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0 Tolerance: ± 1 nm. Red Color Bins [1] Dom. Wavelength (nm) Bin ID Min. Max. - 620.0 635.0 Tolerance: ±1 nm Note: 1.
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1.0 AS AlInGaP RED RELATIVE INTENSITY AS AlInGaP AMBER AS AlInGaP ORANGE 0.5 0 TS AlInGaP RED 500 550 600 650 700 750 WAVELENGTH – nm 1.4 AS AlInGaP 10 TS AlInGaP 1 0.1 1.5 1.7 1.9 2.1 2.3 VF – FORWARD VOLTAGE – V Figure 2. Forward current vs. forward voltage. LUMINOUS INTENSITY (NORMALIZED AT 20 mA) IF – FORWARD CURRENT – mA 100 2.5 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 IF – FORWARD CURRENT – mA Figure 3. Luminous intensity vs. forward current. 30 IF MAX.
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1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 1.00 RELATIVE INTENSITY – % 0.90 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.
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TEMPERATURE 10 - 30 SEC. 10 SEC. MAX. TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 255 - 260 °C 3 °C/SEC. MAX. 217 °C 200 °C 6 °C/SEC. MAX. 150 °C 3 °C/SEC. MAX. –3°C/SEC. 4°C/SEC.MAX. 100 SEC. MAX. 60-120SEC. OVER 2 MIN. TIME TIME Figure 7. Recommended reflow soldering profile. (Acc. to J-STD-020C) Figure 8. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.2 (0.047) 1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.
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USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 13. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 14. Reel dimensions. Note: All dimensions in millimeters (inches). 6 PS 5.0 ± 0.5 (0.197 ± 0.
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4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) HSMx-C110 POSITION IN CARRIER TAPE DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) PART NUMBER DIM. A (SEE TABLE 1) HSMx-C191 SERIES 1.86 (0.073) 0.