Datasheet

3
Package Dimensions, continued
Notes:
1. Dimensions in mm.
2. Tolerance ± 0.1 mm unless otherwise noted.
Device Selection Guide
Footprint AS AlInGaP AS AlInGaP AS AlInGaP TS AlInGaP Package
(mm)
[1,2]
Amber Orange Red Red Description
1.6 x 0.8 x 0.8 HSMA-C190 HSML-C190 HSMC-C190 HSMZ-C190 Untinted, Diused
2.0 x 1.25 x 0.8 HSMA-C170 HSML-C170 HSMC-C170 HSMZ-C170 Untinted, Diused
3.2 x 1.5 x 1.0 HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 Untinted, Non-diused
1.6 x 0.8 x 0.6 HSMA-C191 HSML-C191 HSMC-C191 Untinted, Diused
3.2 x 1.6 x 1.1 HSMA-C150 HSML-C150 HSMC-C150 Untinted, Diused
Absolute Maximum Ratings
T
A
= 25°C
HSMA-C110/170/190/191/150
HSML-C110/170/190/191/150
Parameter HSMC-C110/170/190/191/150 HSMZ-C110/170/190 Units
DC Forward Current
[1,2]
25 25 mA
Power Dissipation 60 65 mW
Reverse Voltage (I
R
= 100 µA) 5 5 V
LED Junction Temperature 95 95 °C
Operating Temperature Range –30 to +85 –30 to +85 °C
Storage Temperature Range –40 to +85 –40 to +85 °C
Soldering Temperature See reow soldering prole (Figure 7 & 8)
Notes:
1. Derate linearly as shown in Figure 4.
2. Drive currents above 5 mA are recommended for best long term performance.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C150
3.2 (0.126 )
0.5 (0.020)
0.50 ± 0.2
(0.020 ± 0.008)
0.6 (0.024)
POLARITY
CATHODE
MARK
1.1 (0.043)
0.50 ± 0.2
(0.020 ± 0.008)
2.0 (0.079)
DIFFUSED
EPOXY
PC BOARD
SOLDERING
TERMINAL
1.6 (0.063)
CATHODE LINE