Datasheet

9
Figure 10. Tape dimensions.
Figure 11. Tape leader.
8.0 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.5 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
DIM. B
(SEE TABLE 1)
4.0 (0.157)
4.0 (0.157)
∅1.50 (0.059)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)
HSMx-C120 SERIES 1.90 (0.075)  1.15 (0.045) 0.75 (0.030)
COVER TAPE
R 0.5 ± 0.05
(0.020 ± 0.002)
2.00 ± 0.05
(0.079 ± 0.002)
END START
THERE SHALL BE A MINIMUM
OF 160 mm (6.3 INCHES) OF 
EMPTY COMPONENT POCKETS
SEALED WITH COVER TAPE.
MOUNTED WITH
COMPONENTS.
MINIMUM OF
230 mm (9.05 IN.) 
MAY CONSIST
OF CARRIER
AND/OR 
COVER TAPE.
THERE SHALL BE A MINIMUM
OF 160 mm (6.3 INCHES) OF 
EMPTY COMPONENT POCKETS
SEALED WITH COVER TAPE.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ± 0.1 mm (± 0.004 in.) unless otherwise specified.
Convective IR Reflow Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060, Surface
Mounting SMT LED Indicator
Components.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.