Datasheet

9
Figure 8a. Recommended SnPb reow soldering prole.
Figure 7. Radiation Pattern.
Figure 9. Recommended wave soldering prole.
DELTA V
F
(NORMALIZED AT 25°C)
-0.3
-100
TEMPERATURE – °C
0.5
0.4
0.2
0.1
0
-0.2
15050-50 0 100
-0.1
0.3
GaP/AlGaAs/
AlInGaP
InGaN/GaN
Figure 6. Forward voltage shift vs. temperature.
Figure 8b. Recommended Pb-free reow soldering prole.
Figure 10. Recommended soldering pad pattern.
2.60
4.50
1.50
SOLDER RESIST
217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
(Acc. to J-STD-020C)
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
LAMINAR WAVE
BOTTOM SIDE
OF PC BOARD
HOT AIR KNIFE
TURBULENT WAVE
FLUXING
PREHEAT
0 10 20
30
50
100
150
200
250
30 40 50
TIME – SECONDS
TEMPERATURE – °C
60 70 80 90 100
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
Note: For detail information on reow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
HSMx-A100 fig 6
NORMALIZED INTENSITY
1.0
0
ANGULAR DISPLACEMENT – DEGREES
0.8
0.6
0.2
0.4
-70 -50 -30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
HSMx-A100 fig 6
240 C MAX.
20 SEC. MAX.
3 C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183 C
100-150 C
–6 C/SEC.
MAX.
60-150 SEC.
3 C/SEC. MAX.