Datasheet

2
Package Dimensions
Absolute Maximum Ratings for Each Die at T
A
= 25˚C
Parameter AlInGaP InGaN GaP Units
DC Forward Current
[1]
20 10 20 mA
Power Dissipation 48 38 52 mW
Reverse Voltage 5 5 5 V
LED Junction Temperature 95 95 95 ˚C
Operating Temperature Range –30 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reow soldering prole (Figure 6 & 7)
Note:
1. Derate linearly as shown in Figure 4.
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
1.6
(0.063 )
0.16 (0.006)
0.5 (0.020)
0.4
(0.016)
LED DIES
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINALS
0.8 (0.031)
CATHODE LINE
0.3 (0.012)
CATHODE LINE
1
2
3
4
POLARITY
1 3
HSMF-C162
AMBER
2 4 RED
HSMF-C163
GREEN
RED
HSMF-C164
BLUE
RED
HSMF-C165
GREEN
RED
HSMF-C166
GREEN
YELLOW
HSMF-C167
GREEN
ORANGE
HSMF-C168
BLUE
GREEN
HSMF-C169
BLUE
AMBER