Datasheet

2
Package Dimensions
Absolute Maximum Ratings for Each Die at T
A
= 25° C
Parameter AlInGaP InGaN GaP Units
DC Forward Current
[1]
20 10 20 mA
Power Dissipation 48 38 52 mW
Reverse Voltage 5 5 5 V
LED Junction Temperature 95 95 95 ˚C
Operating Temperature Range –40 to +85 ˚C
Storage Temperature Range –40 to +85 ˚C
Soldering Temperature See reflow soldering profile (Figure 6 & 7)
Note:
1. Derate linearly as shown in Figure 4.
1.6
(0.063†)
0.16 (0.006)
0.5 (0.020)
0.4
(0.016)
LED DIES
DIFFUSED EPOXY
PC BOARD
SOLDERING
TERMINALS
0.8 (0.031)
CATHODE LINE
0.3 (0.012)
CATHODE LINE
1
2
3
4
POLARITY
1 3
HSMF-C162
AMBER
2 4 RED
HSMF-C163
GREEN
RED
HSMF-C164
BLUE
RED
HSMF-C165
GREEN
RED
HSMF-C166
GREEN
YELLOW
HSMF-C167
GREEN
ORANGE
HSMF-C168
BLUE
GREEN
HSMF-C169
BLUE
AMBER
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS INCHES.
2. TOLERANCE IS ± 0.1 MM ± 0.004 IN. UNLESS OTHERWISE SPECIFIED.