Datasheet

6
Figure 4. Maximum forward current vs. ambient
temperature.
Figure 5. Relative intensity vs. angle.
Figure 7. Recommended Pb-free reflow soldering profile.
Figure 8. Recommended soldering pad pattern.
Figure 6. Recommended reflow soldering profile.
0
25
0
20 60 80 100
5
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
T
A
– AMBIENT TEMPERATURE – °C
40
15
20
10
10 30 50 70 90
InGaN
AlInGaP/GaP
HSMF-C16x fig 5
RELATIVE INTENSITY – %
100
0
ANGLE
80
60
50
70
20
10
30
40
90
-70 -50
-30 0 20 30 50 70 90-90 -20-80 -60 -40 -10 10 40 60 80
230°C MAX.
10 SEC. MAX.
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
TEMPERATURE
4°C/SEC. MAX.
140-160°C
3°C/SEC. MAX.
217°C
200°C
60 - 120 SEC.
6°C/SEC. MAX.
3°C/SEC. MAX.
3°C/SEC. MAX.
150°C
255 - 260°C
100 SEC. MAX.
(Acc. to J-STD-020C)
10 - 30 SEC.
TIME
TEMPERATURE
HSMF-C16x fig 7
0.70
(0.028)
0.70
(0.028)
0.30
(0.012)
0.40
(0.016)
0.60
(0.024)
0.40
(0.016)