Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED (multi-colour) Non-standard Red, Blue 35 mcd, 10 mcd 120 ° 10 mA, 10 mA 1.8 V, 3.4 V

Description

This series of bi-color ChipLEDs is designed with the small-

est footprint to achieve high density of components on

board. They have the industry standard footprint of 1.6

mm x 0.8 mm and a height of only 0.5 mm. This makes

them very suitable for cellular phone and mobile equip-

ment backlighting and indication. They are available in

a wide range of color combinations. In order to facilitate

automated pick and place operation, these ChipLEDs are

shipped in tape and reel, with 4000 units per reel. These

parts are compatible with reow soldering.

HSMF-C16x

Miniature Bi-Color Surface Mount ChipLEDs

Data Sheet

Features

• Small size

• 0603 industry standard footprint

• Diused optics

• Operating temperature range of –30˚C to +85˚C

• Compatible with reow soldering

• Available in various color combination

• Available in 8 mm tape on 7" (178 mm) diameter

reels

Applications

• Keypad backlighting

• Symbol indicator

• LCD backlighting

• Pushbutton backlighting

• Front panel indicator

CAUTION: HSMF-C16x LEDs are class 1A ESD sensitive per JESD22-A114C.01 standard. Please observe appropriate pre-

cautions during handling and processing. Refer to Avago Technologies Application Note AN-1142 for additional details.

Device Selection Guide

Part Number Color Package Description

HSMF-C162 AlInGaP Red / AlInGaP Amber Untinted, Diused

HSMF-C163 AlInGaP Red / InGaN Green Untinted, Diused

HSMF-C164 AlInGaP Red / InGaN Blue Untinted, Diused

HSMF-C165 High Eciency Red / GaP Green Untinted, Diused

HSMF-C166 GaP Yellow / GaP Green Untinted, Diused

HSMF-C167 GaP Orange / GaP Green Untinted, Diused

HSMF-C168 InGaN Green / InGaN Blue Untinted, Diused

HSMF-C169 AlInGaP Amber / InGaN Blue Untinted, Diused

Summary of content (9 pages)

PAGE 1
HSMF-C16x Miniature Bi-Color Surface Mount ChipLEDs Data Sheet Description This series of bi-color ChipLEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint of 1.6 mm x 0.8 mm and a height of only 0.5 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication. They are available in a wide range of color combinations.
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Package Dimensions CATHODE LINE LED DIES 1 3 2 4 0.8 (0.031) 1.6 (0.063 ) DIFFUSED EPOXY 0.5 (0.020) 0.16 (0.006) PC BOARD 0.4 (0.016) CATHODE LINE 0.3 (0.012) SOLDERING TERMINALS POLARITY HSMF-C162 HSMF-C163 HSMF-C164 HSMF-C165 HSMF-C166 HSMF-C167 HSMF-C168 HSMF-C169 1 3 AMBER GREEN BLUE GREEN GREEN GREEN BLUE BLUE 2 4 RED RED RED RED YELLOW ORANGE GREEN AMBER NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.
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Electrical Characteristics at TA = 25˚C Forward Voltage VF (Volts) @ IF[1] Color Typ. Max. Reverse Breakdown VR (Volts) @ IR = 100 µA Min. Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. Thermal Resistance RθJ-PIN (˚C/W) Typ. AlInGaP Red 20 mA 1.9 2.4 5 15 300 AlInGaP Amber 20 mA 1.9 2.4 5 11 300 AlInGaP Red[2] 10 mA 1.8 2.3 5 15 300 AlInGaP Amber[2] 10 mA 1.8 2.3 5 11 300 InGaN Green 10 mA 3.4 3.8 5 35 500 InGaN Blue 10 mA 3.4 3.
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Intensity (Iv) Bin Limits[1] Color Bin Limits[1] Green Color Bins[1] Yellow/Amber Color Bins[1] Dom. Wavelength (nm) Dom. Wavelength (nm) Bin ID Min. Max. Bin ID Min. Max. A 561.5 564.5 A 582.0 584.5 B 564.5 567.5 B 584.5 587.0 C 567.5 570.5 C 587.0 589.5 D 570.5 573.5 D 589.5 592.0 E 573.5 576.5 E 592.0 594.5 F 594.5 597.0 Tolerance: ± 0.5 nm Blue Color Bins[1] Tolerance: ± 0.5 nm Dom. Wavelength (nm) InGaN Green Color Bins[1] Bin ID Min. Max. Dom.
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90 InGaN BLUE 80 InGaN GREEN AS AMBER 1.0 AS ORANGE GaP GREEN AS RED 70 RELATIVE INTENSITY RELATIVE INTENSITY – % 100 60 50 40 30 20 GaP YELLOW 0.5 GaP ORANGE HER 10 0 400 450 500 550 600 650 0 500 700 WAVELENGTH – nm 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. HSMF-C16x fig 1 100 IF – FORWARD CURRENT – mA IF – FORWARD CURRENT – mA 100 AS AlInGaP InGaN 10 1 0.1 1.5 2.0 2.5 3.0 3.5 HER 10 GaP ORANGE GaP YELLOW 1 GaP GREEN 0 1.
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90 AlInGaP/GaP 20 RELATIVE INTENSITY – % IF MAX. – MAXIMUM FORWARD CURRENT – mA 100 25 15 InGaN 10 5 80 70 60 50 40 30 20 10 0 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 4. Maximum forward current vs. ambient temperature. Figure 5. Relative intensity vs. angle. HSMF-C16x fig 5 10 SEC. MAX. TEMPERATURE 230°C MAX. 4°C/SEC. MAX. 140-160°C 3°C/SEC. MAX. 4°C/SEC. MAX.
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USER FEED DIRECTION CATHODE SIDE xxx xxxxx xx xx xxxxxx xxxxx xx PRINTED LABEL Figure 9. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 10. Reel dimensions.
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4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 ± 0.05 (0.079 ± 0.002) 8.00 ± 0.30 (0.315 ± 0.012) CARRIER TAPE USER FEED DIRECTION COVER TAPE 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C16x SERIES DIM. A DIM. B DIM. C ± 0.10 (± 0.004) ± 0.10 (± 0.004) ± 0.10 (± 0.004) 1.75 (0.069) 0.95 (0.037) Figure 11. Tape dimensions.
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Reflow Soldering For more information on reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required under the condition: a) the blue silica gel indicator becoming white/transparent color b) the pack has been opened for more than 1 week Baking recommended condition: 60 ± 5˚C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.