Datasheet

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Data subject to change. Copyright © 2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0671EN
AV02-0427EN - February 20, 2008
Convective IR Reow Soldering
For more information on IR reow
soldering, refer to Application Note
1060, Surface Mounting SMT LED Indi-
cator Components.
Storage Condition:
5 to 30°C @ 60% RH max.
Baking is required under the
condition:
a) Humidity Indicator Card is
>10% when read at 23 ± 5°C
b) Device exposed to factory condi-
tions < 30°C/60% RH more than
672 hours.
Baking recommended condition:
60 ± 5°C for 20 hours.
Figure 11. Tape dimensions.
Figure 12. Tape leader and trailer dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is ±0.1 mm (±0.004 in.) unless otherwise specied.
8.00 ± 0.30
(0.315 ± 0.012)
USER FEED
DIRECTION
DIM. A
(SEE TABLE 1)
3.50 ± 0.05
(0.138 ± 0.002)
1.75 (0.069)
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
CARRIER TAPE
COVER TAPE
DIM. B
(SEE TABLE 1)
4.00 (0.157)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
1.50 (0.059)
HSMF-C15x SERIES 3.52 (0.139) 3.02 (0.119) 1.40 (0.055)
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
CATHODE
DIM. A
± 0.10 (0.004)
DIM. B
± 0.10 (0.004)PART NUMBER
DIM. C
± 0.10 (0.004)