Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED (multi-colour) Non-standard Red, Green, Blue 90 mcd, 120 mcd, 40 mcd 130 ° 20 mA, 20 mA, 20 mA 1.9 V, 3.5 V, 3.5

HSMF-C118

TriColor ChipLED

Data Sheet

Description

The HSMF-C118 tricolor chip-type LED is designed in

an ultra small package for miniaturization. It is the

rst of its kind to achieve such small packaging for

3 dies. With the freedom to have any combination

of colors from mixing of the 3 primary colors, this

will yield a wide variety of colors to suit every ap-

plication and product theme.

The small size, narrow footprint, and low prole make

this LED excellent for back-lighting, status indication,

and front panel illumination applications.

In order to facilitate pick and place operation, this

ChipLED is shipped in tape and reel, with 3000 units

per reel. The package is compatible with IR soldering

and binned by both color and intensity.

Features

• Common anode

• Small 3.2 x 2.7 x 1.1 mm package

• Diused optics

• Red/Green/Blue color combination

• Available in 8 mm tape on

7 inch (178 mm) diameter reels

• High brightness using AlInGaP and InGaN die tech-

nology

• Compatible with reow soldering

Applications

• Backlighting

• Status indicator

• Front panel indicator

• Oce automation, home appliances, industrial

equipment

CAUTION: HSMF-C118 is Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate

precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

Summary of content (8 pages)

PAGE 1
HSMF-C118 TriColor ChipLED Data Sheet Description Features The HSMF-C118 tricolor chip-type LED is designed in an ultra small package for miniaturization. It is the first of its kind to achieve such small packaging for 3 dies. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme.
PAGE 2
Package Dimensions LED DIE 3 2 1.5 (0.059) 4 1 COMMON ANODE 3.2 (0.126 ) 0.6 (0.024) 2.7 (0.106) 2.0 (0.079) 1 DIFFUSED EPOXY 1.1 (0.043) PC BOARD 2 RED 0.5 (0.020) 3 GREEN POLARITY ANODE MARK 0.4 (0.016) 0.7 (0.028) SOLDERING TERMINAL 1.1 (0.043) 4 – 0.05 (0.002) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.1 mm UNLESS OTHERWISE NOTED.
PAGE 3
Absolute Maximum Ratings at TA = 25°C Parameter AlInGaP Red InGaN Green InGaN Blue DC Forward Current[1, 3, 4] 20 20 20 Power Dissipation[1] 48 78 78 [2] DC Forward Current 15 15 15 [2] Power Dissipation 36 59 59 Reverse Voltage (IR = 100 µA) 5 5 5 LED Junction Temperature 95 95 95 Operating Temperature Range –30 to +85 Storage Temperature Range –40 to +85 Soldering Temperature See reflow soldering profile (Figures 6 & 7) Units mA mW mA mW V °C °C °C Notes: 1. Applies when single LED is lit up. 2.
PAGE 4
Intensity (Iv) Bin Limits[1] Bin ID L M N P Q R S Intensity (mcd) Min. Max. 11.20 18.00 18.00 28.50 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 Tolerance: ± 15%. Color Bin Limits [1] Blue Color Bins Bin ID A B C D Dom. Wavelength (nm) Min. Max. 460.0 465.0 465.0 470.0 470.0 475.0 475.0 480.0 Tolerance: ± 1 nm Red Color Bins Bin ID – Dom. Wavelength (nm) Min. Max. 620.0 635.0 Tolerance: ± 1 nm Green Color Bins Bin ID A B C D Dom. Wavelength (nm) Min. Max. 515.0 520.0 520.0 525.
PAGE 5
100 InGaN GREEN AS RED 70 60 50 40 30 20 LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 IF – FORWARD CURRENT – mA InGaN BLUE 80 RELATIVE INTENSITY 1.4 100 90 RED 10 GREEN & BLUE 1 1.0 0.8 0.4 450 500 550 600 650 0.1 700 0 1.5 2.0 2.5 3.0 3.5 4.0 0 Figure 1. Relative intensity vs. wavelength. Figure 2. Forward current vs. forward voltage. 25 5 10 15 0.9 15 GREEN, BLUE 10 5 0 RELATIVE INTENSITY – % AS RED 0.8 0.7 0.6 0.5 0.4 RED BLUE GREEN 0.3 0.2 0.
PAGE 6
USER FEED DIRECTION CATHODE SIDE xxxxx xxxxx xxx xxxxxxx xxxxx PRINTED LABEL Figure 9. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) 10.50 ± 1.0 (0.413 ± 0.039) Ø 13.1 ± 0.5 (Ø 0.516 ± 0.020) Ø 20.20 MIN. (Ø 0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 59.60 ± 1.00 (2.346 ± 0.039) 178.40 ± 1.00 (7.024 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) Figure 10. Reel dimensions. 6 PS 5.0 ± 0.5 (0.197 ± 0.
PAGE 7
4.00 (0.157) DIM. C (SEE TABLE 1) CATHODE 1.50 (0.059) 0.20 ± 0.05 (0.008 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) DIM. B (SEE TABLE 1) CARRIER TAPE USER FEED DIRECTION COVER TAPE 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER HSMF-C118 DIM. A ± 0.10 (± 0.004) DIM. B ± 0.10 (± 0.004) DIM. C ± 0.10 (± 0.004) 3.52 (0.139) 3.02 (0.119) 1.40 (0.055) Figure 11. Tape dimensions.
PAGE 8
Reflow Soldering: For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30°C @ 60%RH max. Baking is required before mounting, if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device expose to factory conditions <30°C/60%RH more than 672 hours. Recommended baking condition: 60±5°C for 20 hours. For product information and a complete list of distributors, please go to our web site: www.avagotech.