Datasheet

ManualsBrandsBROADCOM ManualsLEDs & AccessoriesSMD LED (multi-colour) Non-standard Red, Green, Blue 85 mcd, 180 mcd, 70 mcd 145 ° 20 mA, 20 mA, 20 mA 1.9 V, 3.4 V, 3.4

Features

• Common anode

• Small 1.6 x 1.5 x 0.35 mm package

• Diffused optics

• Red/Green/Blue color combination

• Available in 8 mm tape on 7" diameter reels

• High brightness using AlInGaP and InGaN die

technology

• Compatible with reflow soldering

Applications

• Backlighting

• Status indicator

• Front panel indicator

• Office automation, home appliances, industrial

equipment

Description

The HSMF-C114 tricolor chip-type LED is designed

in an ultra small package for miniaturiza-tion. It is

the first of its kind to achieve such small packaging

and be the thinnest package in the industry for

tricolor package. With the freedom to have any

combination of colors from mixing of the 3 primary

colors, this will yield a wide variety of colors to suit

every application and product theme.

The small size, narrow footprint, and low profile

make this LED excellent for back-lighting, status

indication, and front panel illumination applications.

In order to facilitate pick and place operation, this

ChipLED is shipped in tape and reel, with 4000 units

per reel. The package is compatible with reflow

soldering and binned by both color and intensity.

CAUTION: HSMF-C114 LEDs are Class 1 ESD sensitive. Please observe appropriate precautions

during handling and processing. Refer to Avago Technologies Application Note AN-1142 for

additional details.

HSMF-C114

Surface Mount Tricolor ChipLEDs

Data Sheet

Summary of content (8 pages)

PAGE 1
HSMF-C114 Surface Mount Tricolor ChipLEDs Data Sheet Description The HSMF-C114 tricolor chip-type LED is designed in an ultra small package for miniaturiza-tion. It is the first of its kind to achieve such small packaging and be the thinnest package in the industry for tricolor package. With the freedom to have any combination of colors from mixing of the 3 primary colors, this will yield a wide variety of colors to suit every application and product theme.
PAGE 2
Package Dimensions 3 2 1.50 (0.059) ANODE MARK 4 1 1.60 (0.063) COMMON ANODE 1.10 (0.043) 1 DIFFUSED EPOXY 0.35 (0.014) PC BOARD 0.12 (0.005) 2 3 4 RED GREEN BLUE 0.40 ± 0.15 (0.016 ± 0.006) ANODE MARK 0.50 (0.020) 0.40 (0.016) NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
PAGE 3
Electrical Characteristics at TA = 25°C Part Number AlInGaP Red InGaN Green InGaN Blue Forward Voltage VF (Volts)[1] @ IF = 20 mA Typ. Max. 1.9 2.4 3.4 3.9 3.4 3.9 Reverse Breakdown VR (Volts) @ IR = 100 µA Min. 5 5 5 Capacitance C (pF), @ VF = 0, f = 1 MHz Typ. 10 65 65 Note: 1. VF tolerance: ± 0.1 V. Optical Characteristics at TA = 25°C Part Number AlInGaP Red InGaN Green InGaN Blue Luminous Intensity IV[1] (mcd) @ 20 mA Min. Typ. 28.5 85.0 45.0 180.0 28.5 70.
PAGE 4
Light Intensity (IV) Bin Limits[1] Intensity (mcd) Bin ID Minimum Maximum A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 N 28.50 45.00 P 45.00 71.50 Q 71.50 112.50 R 112.50 180.00 S 180.00 285.00 T 285.00 450.00 Tolerance: ± 15% Note: 1. Bin categories are established for classification of products. Products may not be available in all categories.
PAGE 5
1.2 100 0.8 0.6 0.4 0.2 0 400 500 450 550 600 650 1.0 10 InGaN GREEN & BLUE 1 InGaN GREEN & BLUE 0.4 1.6 2.1 0 3.1 2.6 0 Figure 3. Luminous intensity vs. forward current. 1.2 1.0 RELATIVE INTENSITY 20 15 10 5 0.8 0.6 AlInGaP RED InGaN GREEN & BLUE 0.4 0.2 0 10 30 20 50 40 60 70 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 80 90 TA – AMBIENT TEMPERATURE – °C 0 10 20 30 40 50 60 70 80 DEGREES (°) Figure 4. Maximum forward current vs. ambient temperature. Figure 5.
PAGE 6
USER FEED DIRECTION 0.6 0.5 0.6 CATHODE SIDE xxx xxxxx xxxxx xxxxx xxxxx xx 0.9 0.6 0.9 PRINTED LABEL Figure 8. Recommended soldering land pattern. Figure 9. Reeling orientation. 8.0 ± 1.0 (0.315 ± 0.039) Ø 13.1 ± 0.5 (0.516 ± 0.020) 10.50 ± 1.0 (0.413 ± 0.039) Ø 20.20 MIN. (0.795 MIN.) 3.0 ± 0.5 (0.118 ± 0.020) 178.40 ± 1 (7.024 ± 0.039) 59.60 ± 1.00 (2.346 ± 0.039) 4.0 ± 0.5 (0.157 ± 0.020) 6 PS 5.0 ± 0.5 (0.197 ± 0.020) NOTE: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). Figure 10.
PAGE 7
DIM. C (SEE TABLE 1) 4.00 (0.157) 1.50 (0.059) 0.254 ± 0.05 (0.010 ± 0.002) 1.75 (0.069) 3.50 ± 0.05 (0.138 ± 0.002) DIM. A (SEE TABLE 1) 8.00 ± 0.30 (0.315 ± 0.012) CARRIER TAPE DIM. B (SEE TABLE 1) USER FEED DIRECTION 2.00 ± 0.05 (0.079 ± 0.002) 4.00 (0.157) COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A ± 0.10 (± 0.004) DIM. B ± 0.10 (± 0.004) DIM. C ± 0.10 (± 0.004) HSMF-C114 1.75 (0.069) 1.65 (0.065) 0.55 (0.022) Figure 11. Tape dimensions.
PAGE 8
Convective IR Reflow Soldering For more information on reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30˚C @ 60% RH max. Baking is required before mounting if: 1. Humidity Indicator Card is > 10% when read at 23 ± 5°C. 2. Device exposed to factory conditions < 30°C/60% RH more than 672 hours. Recommended baking condition: 60 ± 5˚C for 20 hours.